Resistor element, stress sensor and method for manufacturing them
A stress sensor in which the direction and magnitude of a stress being applied to a post ( 6 ) bonded to or integrated with the surface of an insulating board ( 3 ) can be grasped from variation in the resistance of a plurality of resistor elements ( 8 ) being stimulated by application of the stress while suppressing variation in the shape of each resistor ( 2 ). The resistor element ( 8 ) comprises a resistor ( 4 ) formed, by screen print, between a pair of electrodes for the resistor element, i.e. circuit pattern electrodes ( 1 ), arranged on the surface of the insulating board ( 3 ). The electrode is connected, through a conductor ( 9 ), with a board terminal part ( 5 ) arranged at one end of the insulating board ( 3 ). The electrode ( 1 ) and the conductor ( 9 ) or a print accuracy adjusting member ( 7 ) have a constant height from the surface of the insulating board ( 3 ). Arrangement of the conductor ( 9 ), the electrode ( 1 ) and the print accuracy adjusting member ( 7 ) is entirely identical or similar for the plurality of resistor elements ( 8 ) in the vicinity thereof.
1. A stress sensor comprising:
a insulating board having first and second surfaces, the second surface being opposite the first surface; a post bonded to or integrated with the first surface of the insulating board; a plurality of resistor elements disposed on the second surface of the insulating board, the resistor elements being composed of a plurality of resistors;
a plurality of resistor-element electrodes disposed on the second surface of the insulating board; a plurality of board terminal pads disposed on the second surface of the insulating board proximate one end thereof; and a plurality of conductors disposed on the second surface of the insulating board, wherein the resistors are formed by a screen printing method between pairs of the resistor-element electrodes, the resistor-element electrodes are connected to the board terminal pads through the conductors, and the resistor-element electrodes and the conductors have a predetermined height from the second surface of the insulating board, the arrangements of the conductors and the resistor-element electrodes, in the vicinities of the respective resistor elements, are equal or similar to each other, and the direction and magnitude of a stress applied to the post are grasped from variation in resistance of the resistor elements caused by stimulation resulting from the application of the stress while suppressing variation in shape of each resistor element.
2. The stress sensor of claim 1 , wherein said electrodes composed of parts of said conductors, obtained by an additive method; and said resistor elements formed by film formation, wherein the ratio L/h of the distance (L) between said pair of the electrodes to the height (h) of the electrodes is 30 or more.
3. The stress sensor of claim 1 , wherein said electrodes composed of parts of said conductors, obtained by an additive method; and said resistor elements formed by film formation, wherein a height deviation of said pair of the electrodes is 0 or less.
4. The stress sensor of claim 1 , wherein the arrangements of the conductors and the resistor-element electrodes, in the vicinities of the respective resistor elements, are each formed so as to surround at least three sides of each of the resistors.
5. The stress sensor of claim 1 , wherein the resistor-element electrodes and the conductors are disposed so as to intermittently surround each of the resistor elements.
6. The stress sensor of claim 1 , wherein the resistor-element electrodes and the conductors are disposed so as to continuously surround each of the resistor elements.
7. The stress sensor of claim 1 , further comprising print accuracy adjustment members having the predetermined height from the second surface of the insulating board.
8. The stress sensor of claim 7 , wherein the arrangements of the conductors, the resistor-element electrodes, and the print accuracy adjustment members, in the vicinities of the respective resistor elements, are equal or similar to each other.
9. The stress sensor of claim 7 , wherein the arrangements of the conductors, the resistor-element electrodes, and the print accuracy adjustment members, in the vicinities of the respective resistor elements, are each formed so as to surround at least three sides of each of the resistors.
10. The stress sensor of claim 7 , wherein the resistor-element electrodes, the conductors, and the print accuracy adjustment members are disposed so as to intermittently surround each of the resistor elements.
11. The stress sensor of claim 7 , wherein the resistor-element electrodes, the conductors, and the print accuracy adjustment members are disposed so as to continuously surround each of the resistor elements.