Production method of α-SiC wafer
View Patent ↗The present invention has its object to make it possible to produce an α-SiC wafer with stability and good reproducibility at low cost without using a seed crystal substrate that is expensive and less available. In each of crucibles 11 a , 11 b , 11 c , and so on, a β-SiC substrate 19 and an SiC raw material 17 are placed to face each other in close proximity. These crucibles are stacked in layers, and placed inside a radiation tube 40 . The radiation tube 40 is heated by an induction heating coil 23 , radiates radiation heat, and uniformly heats the crucibles 11 a , 11 b , 11 c and so on. The SiC raw material in each of the crucibles is sublimated and recrystallized on a surface of the β-SiC substrate 19.
1. A production method of an α-SiC wafer in a method of growing an α-SiC crystal on a substrate by an SiC powder sublimation and recrystallization method, comprising the steps of:
setting a β-SiC crystal produced by a CVD method as the substrate and setting a crucible, in which the substrate and an SiC powder raw material are placed to be close to each other, as one unit;
stacking a plurality of the units vertically in layers and placing them inside a radiation tube of a dimension higher than height of the multilayer unit;
heating the radiation tube by an induction heating coil to uniformly heat-treat the multilayer unit inside the tube, and thereby growing α-SiC phases on a plurality of substrates up to thickness close to product thickness; and
thereafter, removing part or an entire of the aforementioned substrates to thereby produce the α-SiC wafers.
2. The production method of the α-SiC wafer according to claim 1 , wherein:
after the α-SiC phase is grown on a β-SiC crystal produced by a CVD method to be a little thicker than final thickness of the wafer, part or the entire of the aforementioned substrates is removed to produce the wafers of the α-SiC phase without cutting grown bulk layers.
3. A production method of an α-SiC wafer in a method of growing an α-SiC crystal on a substrate by an SiC powder sublimation and recrystallization method, comprising the steps of:
setting a β-SiC crystal produced by a CVD method as the substrate and setting a crucible, in which the substrate and an SiC powder raw material are placed to be close to each other, as one unit;
stacking a plurality of the units in layers and placing them inside an outer crucible;
surrounding an entire circumference of the outer crucible with a heat insulating material;
heating the aforementioned outer crucible surrounding a plurality of the aforementioned units stacked in layers by an induction heating coil to uniformly heat-treat the multilayer unit inside the outer crucible, and thereby growing α-SiC phases on a plurality of substrates up to thickness close to product thickness; and
thereafter, removing part or an entire of the aforementioned substrates to thereby produce the α-SiC wafers.
4. The production method of the α-SiC wafer according to claim 3 , wherein:
after the α-SiC phase is grown on a β-SiC crystal produced by a CVD method to be a little thicker than final thickness of the wafer, part or the entire of the aforementioned substrates is removed to produce the wafers of the α-SiC phase without cutting grown bulk layers.
5. A production method of an α-SiC wafer in a method of growing an α-SiC crystal on a substrate by an SiC powder sublimation and recrystallization method, comprising the steps of:
setting a β-SiC crystal produced by a CVD method as the substrate and setting a crucible, in which the substrate and an SiC powder raw material are placed to be close to each other, as one unit;
inserting magnetic shield rings in a top and bottom periphery portion of a plurality of units stacked in layers;
heat-treating the multilayer unit uniformly so that magnetic flux by an induction heating coil does not concentrate on the top and bottom periphery portions, and thereby growing α-SiC phases on a plurality of substrates up to thickness close to product thickness; and
thereafter, removing part or an entire of the aforementioned substrates to thereby produce the α-SiC wafers.
6. The production method of the α-SiC wafer according to claim 5 , wherein:
after the α-SiC phase is grown on a β-SiC crystal produced by a CVD method to be a little thicker than final thickness of the wafer, part or the entire of the aforementioned substrates is removed to produce the wafers of the α-SiC phase without cutting grown bulk layers.