Color image sensor with enhanced colorimetry and method for making same

1. A method for making a color image sensor, comprising steps of:

forming on the front face of a semiconductive wafer, a series of active zones comprising image detection circuits and each corresponding to a respective image sensor, each active zone comprising photosensitive zones covered with conductive layers and insulating layers enabling the collection of electrical charges generated in the photosensitive zones,

transferring the wafer by its front face against the front face of a supporting substrate,

eliminating a major part of the thickness of the semiconductive wafer, leaving a very thin semiconductive layer on the substrate, this very thin semiconductive layer comprising the photosensitive zones,

depositing and etching of color filters having several different colors on the thinned semiconductive layer.

2. The method according to claim 1 , wherein the transfer is done by gluing, soldering, anodic bonding or simple molecular adhesion.

3. The method according to claim 2 , wherein the thickness of the semiconductive wafer after thinning is about 8 to 30 micrometers, including the thickness of the stack of conductive layers and insulating layers.

4. The method according to claim 2 , wherein, on the supporting substrate, prior to the transfer of the semiconductive wafer, there are formed metallized via holes laid out with the same geometry as connection pads formed on the semiconductive wafer around each active zone and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pads of the sensor.

5. The method according to claim 1 , wherein the thickness of the semiconductive wafer after thinning is about 8 to 30 micrometers, including the thickness of the stack of conductive layers and insulating layers.

6. The method according to claim 5 , wherein , on the supporting substrate, prior to the transfer of the semiconductive wafer, there are formed metallized via holes laid out with the same geometry as connection pads formed on the semiconductive wafer around each active zone and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output parts of the sensor.

7. The method according to claim 1 , wherein , on the supporting substrate, prior to the transfer of the semiconductive wafer, there are formed metallized via holes laid out with the same geometry as connection pads formed on the semiconductive wafer around each active zone and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pacts of the sensor.

8. An image sensor comprising;

on a supporting substrate, a superimposed unit comprising firstly a semiconductive layer in which there is formed a matrix array of photosensitive zones and, secondly, a stack of conductive layers and insulating layers enabling the collection of the electrical charges generated by light in the photosensitive zones, wherein color filters of several different colors are deposited on this superimposed unit, on the very thin semiconductive layer side, so that the light passes through in the order given, through the color filters, and then the photosensitive semiconductive zones, and then the stack of insulating and conductive layers, without encountering said conductive layers, before reaching said very thin semiconductive layer.

9. The sensor according to claim 8 , wherein the semiconductive layer containing the photosensitive zones has a thickness of about 3 to 20 micrometers above the stack of conductive and insulating layers.

10. The sensor according to claim 9 , wherein the supporting substrate comprises active or passive circuit elements.

11. The sensor according to claim 9 , wherein the semiconductive wafer and the supporting substrate are made of silicon.

12. The sensor according to claim 9 , wherein the supporting substrate comprises metallized via holes arranged with the same geometry as connection pads formed on the silicon wafer around each active zone, and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pads of the sensor.

13. The sensor according to claim 8 , wherein the supporting substrate comprises active or passive circuit elements.

14. The sensor according to claim 13 , wherein the semiconductive wafer and the supporting substrate are made of silicon.

15. The sensor according to claim 13 , wherein the supporting substrate comprises metallized via holes arranged with the same geometry as connection pads formed on the silicon wafer around each active zone, and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pads of the sensor.

16. The sensor according to claim 8 , wherein the semiconductive wafer and the supporting substrate are made of silicon.

17. The sensor according to claim 16 , wherein the supporting substrate comprises metallized via holes arranged with the same geometry as connection pads formed on the silicon wafer around each active zone, and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pads of the sensor.

18. The sensor according to claim 8 , wherein the supporting substrate comprises metallized via holes arranged with the same geometry as connection pads formed on the silicon wafer around each active zone, and coming into contact with these pads during the transfer, the metallized via holes opening into the rear of the supporting substrate to form input/output pads of the sensor.