IP Library Granted Patent US 7,056,470
Granted Patent B2
US 7,056,470 · App. 10/498,174 · Granted Jun 6, 2006

Capacitor-grade lead wires with increased tensile strength and hardness

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Quick Facts
Patent No.
US 7,056,470
App. No.
10/498,174
Granted
Jun 6, 2006
Kind
B2
Abstract

A capacitor-grade wire made from powder metallurgy containing at least niobium and silicon, wherein the niobium is the highest weight percent metal present in the niobium wire. The wire having a controlled tensile strength at finish diameter exceeds the strength of capacitor-grade wire formed by ingot metallurgy. Also, the powder metallurgy wire hardness exceeds capacitor-grade wire formed from ingot metallurgy with electrical leakage meeting the specifications normally applied to capacitor grade tantalum, niobium or niobium-zirconium lead wire at sinter temperatures of about 1150° C. and above.

Claims (18)

1. A process for making a silicone-doped niobium lead wire comprising:

(a) forming a low oxygen niobium powder by hydriding a niobium ingot or a niobium bar and grinding or milling the ingot or the bar, and thereby making a powder having a Fisher Average Particle Diameter particle size range of less than 150 microns;

(b) (i) dehydriding the niobium powder, and

(ii) deoxidating the dehydrided niobium powder thereby forming a low oxygen niobium powder;

(c) blending the low oxygen niobium powder with a silicon additive powder, and compacting the powder blend of low oxygen niobium powder and silicon additive powder by cold isotactic pressing to form a bar;

(d) thermomechanically processing the bar into a rod; and

(e) subjecting the rod to the following sequential steps,

(i) annealing at a temperature of about 2500° F. for 1.5 hours,

(ii) rolling to a diameter of about 0.440 inches,

(iii) annealing at a temperature of about 2500° F. for 1.5 hours

(iv) reducing to a diameter of about 0.1 inches, and

(v) drawing to a wire having a diameter of at least about 0.005 inches.

2. The process of claim 1 , wherein the silicon is added in an amount that is less than about 600 ppm.

3. The process of claim 1 , wherein the silicon is added in an amount ranging from about 150 to about 300 ppm.

4. The process of claim 1 , wherein the wire further comprises a metal component selected from the group consisting of tantalum, zirconium, titanium, and combinations thereof.

5. The process of claim 1 , wherein the niobium powder has an oxygen level that is below about 400 ppm.

6. The process of claim 1 , wherein the wire has a tensile strength exceeding capacitor-grade niobium wire and niobium-zirconium alloys derived directly from ingot metallurgy.

7. The process of claim 1 wherein the niobium powder has an oxygen level of less than 200 ppm.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0069 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0103 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0178 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0188 →
RELEASE OF SECURITY INTEREST Recorded Nov 2, 2021
From: GLAS TRUST CORPORATION LIMITED
To: H.C. STARCK INC.
Reel/Frame 057993/0198 →