Process for producing high-purity epoxy resin and epoxy resin composition
View Patent ↗A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C. to produce a multi-functional epoxy compound represented by the general formula (II)
1. A process for production of a high-purity epoxy compound with total chlorine content of less than 500 ppm, said process comprising:
reacting an epoxy compound according to formula (I):
wherein,
R represents a dihydric phenol compound residue and/or a dihydric alcohol compound residue, and
n represents a numerical value with the average greater than 0 and not greater than 10, in which the proportion of the component having n equal to 0 is more than 70% and less than 100%,
in the presence of alkali metal hydroxide at temperature of 95° C.-150° C., to produce an epoxy compound according to formula (II):
wherein,
R represents a dihydric phenol compound residue and/or a dihydric alcohol compound residue,
n represents a numerical value with the average greater than 0 and not greater than 10, and
X is a hydrogen atom or a group according to formula (III):
wherein,
R has the above-described meaning in which the component with X represented by the-general formula (III) is always contained.
2. A process according to claim 1 , wherein the resultant epoxy compound obtained by the process contains the epoxy compound of formula (I) in the proportion of not less than 90% and less than 100%, and the epoxy compound of formula (II) in the proportion of greater than 0% and not greater than 10%.
3. A process according to claim 1 , wherein said alkali metal hydroxide is potassium hydroxide.
4. A process according claim 1 , wherein 5-100 g of potassium hydroxide is used per 1 kg of said epoxy compound of formula (I), and is used in the reaction in the form of aqueous solution of potassium hydroxide of 80% or higher in concentration.
5. A process according to claim 1 , wherein the reaction is conducted in the presence of a tertiary alcohol.
6. A process according to claim 1 , wherein said epoxy compound of formula (I) is an epoxy compound according to formula (IV):
wherein,
R 1 -R 8 may be same or different, and each of R 1 -R 8 is a hydrogen, alkyl, allyl, phenyl group or halogen atoms,
Y represents a direct bond, alkyl group with carbon number of 1-20, allyl, phenyl, aralkyl, biphenylaralkyl, oxygen, sulphur, sulfone, or carboxyl group; and
n is a numerical value with average greater than 0 and not greater than 10; and/or an epoxy compound according to formula (V):
wherein,
R 1 , R 2 , R 5 , and R 6 represent hydrogen, alkyl, allyl, phenyl group, or halogen atom, and may be same or different; and
n is a numerical value with average greater than 0 and not greater than 10.
7. A process for according to claim 6 , wherein said epoxy compound of formula (IV) is a tetramethyl bisphenol epoxy resin or a tetramethyl biphenyl epoxy resin.
8. A process according to claim 1 , wherein the resultant epoxy compound obtained by the process has a total chlorine content of less than 350 ppm.
9. A process according to claim 1 , wherein, for the epoxy of the compound of Formula (I) that is to be reacted, the proportion of the epoxy compound having n equal to 0 is 75%-99%.
10. A process according to claim 1 , wherein, for the epoxy of the compound of Formula (I) that is to be reacted, the proportion of the epoxy compound having n equal to 0 is 80%-99%.
11. A process according to claim 2 , wherein the resultant epoxy compound obtained by the process contains the epoxy compound of formula (II) in an amount of 1-10%.
12. A process according to claim 11 , wherein the resultant epoxy compound obtained by the process contains the epoxy compound of formula (II) in an amount of 1-6%.
13. A process according to claim 12 , wherein the resultant epoxy compound obtained by the process contains the epoxy compound of formula (II) in an amount of 2-5%.