Corrective Assignment to Correct the Typographical Error in Name and Address Spelling of Assignee Previously Recorded on Reel 024160 Frame 0714. Assignor(S) Hereby Confirms the Correct Spelling as Nippon Steel Chemical Co., Ltd. of 14-1, Sotokanda 4-Chome, Chiyoda-Ku, Tokyo, Japan.

Recorded: 2011-06-01 Pages: 8

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Assignor

TOTO KASEI CO. LTD.

Executed: 2010-03-29

Assignee

NIPPON STEEL CHEMICAL CO., LTD.

14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, JAPAN

Covered Properties (13)

Epoxy Resin Composition Containing Alkylated Hydroquinone Epoxide

Patent: 5,494,950 →

Application: 08/223,680 →

Fire-Retardant Compound, a Process for Producing Said Fire-Retardant Compound and a Fire-Retarded Thermoplastic Resin Composition Including Said Fire-Retardant Compound

Patent: 5,837,799 →

Application: 08/697,457 →

Epoxy Resin Compositions Containing Phosphorus, Flame Retardant Resin Sheet Using Said Epoxy Resin Containing Phosphorus, Resin Clad Metal Foil, Prepreg and Laminated Board, Multi Layer Board

Patent: 6,524,709 →

Application: 09/688,033 →

Curing Method to Cure Epoxy Resins in a Short Time, and a Method for Absorbing Electromagnetic Wave Through Cured Epoxy Resins Obtained by Said Curing Method

Patent: 6,566,414 →

Application: 09/899,126 →

Publication: US 2002/0024170

Thermoplastic Polyhydroxypolyether Resin and an Insulation Film Produced Therefrom

Patent: 6,762,251 →

Application: 10/233,608 →

Publication: US 2004/0044146

Epoxy Resin Compositions Containing Phosphorus, Flame Retardant Resin Sheet Using Said Epoxy Resin Containing Phosphorus, Resin Clad Metal Foil, Prepreg and Laminated Board, Multi Layer Board

Patent: 6,933,050 →

Application: 10/359,205 →

Publication: US 2003/0162935

Process for Producing High-Purity Epoxy Resin and Epoxy Resin Composition

Patent: 7,268,192 →

Application: 10/511,553 →

Publication: US 2005/0131195

Non-Crystalline Diglycidyl Ether of Biphenol or Bisphenol

Patent: 7,332,557 →

Application: 10/755,447 →

Publication: US 2004/0176563

Epoxy Resin, Epoxy Resin Composition Containing the Epoxy Resin as an Essential Component and a Cured Product Containing the Epoxy Resin as an Essential Component

Patent: 7,906,562 →

Application: 12/223,793 →

Publication: US 2010/0168268

Novel Epoxy Phosphorous-Containing Resin, Epoxy Resin Composition Essentially Containing the Epoxy Resin, and Cured Product of the Epoxy Resin Composition

Patent: 8,057,902 →

Application: 12/449,918 →

Publication: US 2010/0093928

Epoxy Resin Composition

Application: 12/452,506 →

Publication: US 2010/0184923

Resin Composition for Optical Waveguide, and Optical Waveguide Produced by Employing the Resin Composition

Patent: 7,995,895 →

Application: 12/496,088 →

Publication: US 2010/0003004

Novel Thermoplastic Polyhydroxy Polyether Resin and Resin Composition Comprising the Same

Patent: 7,858,173 →