Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same
View Patent ↗The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises: a) the electrografting of an organic film onto the conductive or semiconductive surface; and then b) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted. It also relates to applications of this method and to structures obtained by its implementation.
1. A method of bonding a first object having a polymer surface together with a second object having an electrically conductive or semiconductive surface, the method comprising the steps of:
a) electrografting a polymer film onto the conductive or semiconductive surface of the second object; and then
b) bonding the polymer surface of the first object to the polymer film electrografted onto the conductive or semiconductive surface of the second object;
wherein the electrografting of the polymer film is an electroinitiated grafting, and
wherein which the polymer film is obtained from compounds selected from the group consisting of monomers and prepolymers that are partly or completely functionalized by cyclic groups that can be cleaved by nucleophilic or electrophilic attack.
2. The method as claimed in claim 1 , wherein the bonding includes a cold bonding.
3. The method as claimed in claim 2 , wherein the cold bonding is carried out by means of a substance capable of dissolving or swelling the polymer surface to be bonded and the polymer film electrografted onto the conductive or semiconductive surface.
4. The method as claimed in claim 1 , wherein the polymer constituting the polymer surface is selected from the group consisting of polyethylenes, polypropylenes, polystyrenes, polyacrylonitriles, polysiloxanes, polyesters, polyorthoesters, polycaprolactones, polybutyrolactones, polyacrylics, polymethacrylics, polyacrylamides, epoxide resins, copolymers thereof and blends thereof.
5. The method as claimed in claim 1 , wherein the polymer constituting the polymer surface includes a hotmelt polymer.
6. The method as claimed in claim 1 , wherein the polymer surface includes a polymer film coating a conductive or semiconductive material.
7. The method as claimed in claim 1 , wherein the polymer film has a thickness of between 50 and 300 nm.
8. The method as claimed in claim 1 , wherein the bonding includes a hotmelt bonding.
9. The method as claimed in claim 1 , wherein the bonding includes a combination of a hotmelt bonding and a cold bonding.
10. A method for bonding a first object having a polymer surface together with a second object having an electrically conductive or semiconductive surface, the method comprising the steps of:
a) electrografting an organic film onto the conductive or semiconductive surface of the second object; and then
b) bonding the polymer surface of the first object to the polymer film electrografted onto the conductive or semiconductive surface of the second object thus grafted,
wherein the bonding includes a cold bonding or a combination of the cold bonding and a hotmelt bonding, and
wherein the cold bonding is carried out by means of a substance capable of dissolving or swelling the polymer surface to be bonded and the organic film electrografted onto the conductive or semiconductive surface.
11. The method as claimed in claim 10 , wherein the electrografting of the organic film includes an electroinitiated grafting.
12. The method as claimed in claim 11 , wherein the organic film includes a polymer film.
13. The method as claimed in claim 12 , wherein the polymer film is obtained from compounds selected from the group consisting of monomers and prepolymers that are partly or completely functionalized by vinyl groups.
14. The method as claimed in claim 13 , wherein the polymer film is obtained from a vinyl monomer selected from the group consisting of acrylonitrile, methacrylonitrile, acrylates and methacrylates, acrylamides, methacrylamides, cyanoacrylates, acrylic acid, methacrylic acid, styrene, vinyl halides, N vinylpyrrolidone, 2 vinylpyridine, 4 vinylpyridine and vinyl-terminated telechelic compounds.
15. The method as claimed in claim 12 , wherein the polymer film is obtained from compounds selected from the group consisting of monomers and prepolymers that are partly or completely functionalized by cyclic groups that can be cleaved by nucleophilic or electrophilic attack.
16. The method as claimed in claim 11 , wherein the organic film is obtained from diazonium, sulfonium, phosphonium or iodonium salts, or mixtures thereof.
17. The method as claimed in claim 10 , wherein the polymer constituting the polymer surface is selected from the group consisting of polyethylenes, polypropylenes, polystyrenes, polyacrylonitriles, polysiloxanes, polyesters, polyorthoesters, polycaprolactones, polybutyrolactones, polyacrylics, polymethacrylics, polyacrylamides, epoxide resins, copolymers thereof and blends thereof.
18. The method as claimed in claim 10 , wherein the polymer constituting the polymer surface includes a hotmelt polymer.
19. The method as claimed in claim 10 , wherein the polymer surface includes a polymer film coating a conductive or semiconductive material.
20. The method as claimed in claim 10 , wherein the organic film has a thickness of between 50 and 300 nm.