IP Library Granted Patent US 7,462,326
Granted Patent B2
US 7,462,326 · App. 10/528,954 · Granted Dec 9, 2008

Device for the detection of at least one ligand contained in a sample that is to be analyzed

Assignee: Micronas Holding GmbH
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Quick Facts
Patent No.
US 7,462,326
App. No.
10/528,954
Granted
Dec 9, 2008
Kind
B2
Abstract

Disclosed is a device for detecting at least one ligand contained in a sample that is to be analyzed. Said device comprises an optical waveguide, on the surface of which at least one ligand-specific receptor is directly or indirectly immobilized. The ligand bonds to said receptor during contact therewith. The inventive device comprises at least one optical source of radiation for injecting excitation radiation into the waveguide, the radiation being used for exciting emission of luminescence radiation in accordance with the bonding of the ligand to the receptor. At least one radiation receiver is integrated into the semiconductor substrate of a semiconductor chip so as to detect the luminescence radiation. The waveguide is integrated in a monolithic manner into the semiconductor substrate or is applied thereupon as a wave-guiding layer.

Claims (32)

1. A device for the detection of at least one ligand contained in a sample that is to be analyzed, said device comprising:

an optical waveguide defining a single light path along which multiple detection fields and multiple radiation receivers are disposed, each detection field including at least one receptor for contacting a ligand to form a specific bond with the ligand;

at least one optical source of radiation for injecting excitation radiation into the waveguide, the radiation being used for exciting the emission of luminescence radiation as a function of the bonding of ligands to receptors; and

a semiconductor chip having said radiation receivers on a semiconductor substrate, each detection field having one radiation receiver associated therewith, each radiation receiver operative for detecting only the luminescence radiation sent out by the detection field associated therewith, wherein:

the waveguide is monolithically integrated with the semiconductor substrate or is in the form of a waveguide layer located on the semiconductor chip; and

the radiation receiver associated with each detection field is integrated into the semiconductor substrate facing the detection field directly on the back side of the waveguide facing away from the detection field.

2. The device of claim 1 , wherein the semiconductor chip includes a boundary surface opposite the receptors between the semiconductor chip and the waveguide, the boundary surface running between two planes that are oriented parallel to the plane of extension of the semiconductor chip, wherein the distance between the two planes is less than the wavelength of the excitation radiation.

3. The device of claim 2 , wherein the distance between the two planes is less than either one-half, one-fourth or one-eighth of the wavelength of the excitation radiation.

4. The device of claim 1 , wherein the semiconductor chip, laterally next to the waveguide, has an electronic circuit.

5. The device of claim 1 , wherein:

between the semiconductor chip and the waveguide there is an intermediate layer, the optical index of refraction of which is less than that of the waveguide;

a side of the intermediate layer adjacent the semiconductor chip conforms to a surface of the semiconductor chip; and

a side of the intermediate layer adjacent the waveguide is essentially plane.

6. The device of claim 5 , wherein the intermediate layer is an adhesive coating.

7. The device of claim 6 , wherein the adhesive coating is a polymer coating.

8. The device of claim 1 , wherein the waveguide is connected with the semiconductor chip at least at one bonding point.

9. The device of claim 1 , wherein the waveguide is a thin-film layer of a transparent polymer material.

10. The device of claim 9 , wherein the polymer material is polystyrene.

11. The device of claim 1 , wherein the waveguide is a metal oxide layer.

12. The device of claim 11 , wherein the metal oxide layer is either a silicon dioxide layer or a tantalum pentoxide layer.

13. The device of claim 1 , wherein the optical radiation source is a semiconductor radiation source that is integrated into the semiconductor chip.

14. The device of claim 1 , further including an optical injection system provided in the emission area of the optical radiation source for deflecting optical radiation emitted by the optical radiation source to the waveguide.

15. The device of claim 14 , wherein:

the optical injection system is part of the waveguide; and

the optical injection system includes at least one of the following: a prism, an optical lattice and/or a deflecting mirror.

16. The device of claim 1 , wherein the detection fields are spaced from one another and are positioned relative to the radiation receivers so each radiation receiver receives essentially no luminescence radiation from a detection field of an other radiation receiver.

17. The device of claim 1 , wherein:

the receptors are located in an interior cavity of a flow-through measurement chamber that has at least one inlet opening and one outlet opening; and

the semiconductor chip defines a wall area of the flow-through measurement chamber.

18. The device of claim 17 , further including a heating and/or cooling device for controlling a temperature of the flow-through measurement chamber.

19. The device of claim 18 , wherein the heating and/or cooling device is a Peltier element.

20. The device of claim 17 , wherein the flow-through measurement chamber includes at least one reagent and/or reaction partner for the detection of the bonding of at least one ligand to at least one receptor.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 29, 2012
From: MICRONAS GMBH
To: ENDRESS+HAUSER CONDUCTA GESELLSCHAFT FUER MESS- UND REGELTECHNIK MBH+CO. KG
Reel/Frame 027783/0245 →
CHANGE OF NAME Recorded Dec 14, 2011
From: MICRONAS HOLDING GMBH
To: MICRONAS GMBH
Reel/Frame 027379/0419 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 17, 2008
From: LEHMANN, MIRKO; MULLER, CLAAS; KLAPPROTH, HOLGER; FREUND, INGO
To: MICRONAS HOLDING GMBH
Reel/Frame 020814/0995 →
Priority Claims (1)
DE 102 45 435 · Sep 27, 2002 · national
Continuity (1)
Related Publication 20060051244A1 · Mar 9, 2006