Smartcard and method for production of a smartcard
The invention relates to a smart card and also to a method of producing such a smart card having a card body ( 11 ), at least one recess ( 12 a, 12 b ) arranged therein for receiving at least one chip module ( 16 ) having module connections ( 17 ) in the edge region ( 16 a ) of the chip module ( 16 ) and a conductive structure body embedded in the card body ( 11 ) and having body contact connections ( 13 ), in particular an antenna having antenna connections which are arranged below the edge region ( 16 a ) of the chip module ( 16 ), where, with the chip module ( 16 ) installed between the module connections ( 17 ) on the one hand and the body contact connections ( 13 ) on the other hand, adhesive parts ( 14 ) preferably applied at points and made of elastic, conductive material are arranged between the connections ( 13, 17 ) with pressure being applied to produce a contact.
1. A method of producing smart cards having a card body ( 11 ), at least one recess ( 12 a , 12 b ) arranged therein for receiving at least one chip module ( 16 ) having module connections ( 17 ) in the edge region ( 16 a ) of the chip module ( 16 ) and a conductive structure body embedded in the card body ( 11 ) and having body contact connections ( 13 ), in particular an antenna having antenna connections which are arranged below the edge region ( 16 a ) of the chip module ( 16 ), characterized in that, prior to installation of the chip module ( 11 ), adhesive parts ( 14 ) made of elastic, conductive material are applied at points to the body contact connections ( 13 ) and/or the module connections ( 17 ) and cured, and then the chip module ( 11 ) is installed in the card body ( 11 ) with pressure being applied to the adhesive parts ( 14 ) made of elastic material.
2. The method according to claim 1 , characterized in that, prior to installation of the chip module ( 11 ), the adhesive parts ( 14 ) are applied so as to be about 0.05 to 0.15 mm higher than upper edge regions ( 15 a ) of cutouts ( 15 ) arranged in the card body, which cutouts are designed to receive the adhesive parts ( 14 ).
3. A smart card having a card body ( 11 ), at least one recess ( 12 a , 12 b ) arranged therein for receiving at least one chip module ( 16 ) having module connections ( 17 ) in the edge region ( 16 a ) of the chip module ( 16 ) and a conductive structure body embedded in the card body ( 11 ) and having body contact connections ( 13 ), in particular an antenna having antenna connections which are arranged below the edge region ( 16 a ) of the chip module ( 16 ), wherein, with the chip module ( 16 ) installed between the module connections ( 17 ) on the one hand and the body contact connections ( 13 ) on the other hand, adhesive parts ( 14 ) made of conductive material are arranged between the connections ( 13 , 17 ) characterized in that the adhesive parts ( 14 ) are made of elastic material, are applied at points, are cured prior to installing the chip module ( 16 ), with pressure being applied to produce a contact.
4. The smart card according to claim 3 , characterized in that the adhesive parts ( 14 ) are arranged within cutouts ( 15 ) which are arranged in the card body ( 11 ) below the edge region ( 16 a ) of the chip module ( 16 ) and at the bottom terminate with the body contact connections ( 13 ).
5. The smart card according to claim 4 , characterized in that the cutouts ( 15 ) have a volume size that is sufficient to completely receive the adhesive parts ( 14 ) under the application of pressure.
6. The smart card according to claim 4 , characterized in that in the direction of the card body thickness the cutouts ( 15 ) have height dimensions ( 14 b ) that are smaller than the height ( 14 , 14 b ) of the adhesive parts ( 14 ) applied at points, without the application of pressure.
7. The smart card according to claim 3 , characterized in that the adhesive parts ( 14 ) form a resilient buffer in order to produce a permanent contact between the chip module connections ( 13 ) and body contact connections ( 17 ) following installation of the chip module ( 11 ).
8. The smart card according to claim 3 , characterized in that the adhesive parts ( 14 ) primarily act along the card body thickness as a resilient buffer.