IP Library Granted Patent US 7,572,624
Granted Patent B2
US 7,572,624 · App. 10/539,817 · Granted Aug 11, 2009

DNA chip comprising a microarray made of an microelectrode system

Assignee: Siemens Aktiengesellschaft
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Quick Facts
Patent No.
US 7,572,624
App. No.
10/539,817
Granted
Aug 11, 2009
Kind
B2
Abstract

A DNA chip includes a carrier and a microarray of spots containing immobilised catcher molecules which are arranged on the carrier. Each spot contains a microelectrode system for the impedance spectroscopic detection of binding events occurring between the catcher molecules and target molecules of an analyte solution applied to the spots. The microelectrode system has a pair of polarisation electrodes in order to produce an alternating electromagnetic field and a pair of sensor electrodes for measuring a voltage drop in the analyte.

Claims (20)

1. A DNA chip, comprising:

a carrier; and

a microarray of spots, arranged on the carrier, containing immobilized catcher molecules, each spot containing a thin-film four pole system for impedance-spectroscopic detection of binding events between the catcher molecules and target molecules of an analyte solution applied to the spots the thin-film four-pole system including two polarization electrodes for generating an alternating electromagnetic field and two sensor electrodes for measuring a voltage drop in the analyte.

2. The DNA chip as claimed in claim 1 , wherein the carrier includes a silicon substrate on which the microelectrode system is integrated using thin-film technology.

3. The DNA chip as claimed in claim 1 , wherein at least one sensor electrode is assigned a shielding electrode, which is held at the same electrical potential as the sensor electrode.

4. The DNA chip as claimed in claim 3 , wherein the electrical potential of the sensor electrode is held at the shielding electrode by a buffer amplifier connected to the sensor electrode and having a gain of 1.

5. The DNA chip as claimed in claim 4 , wherein the buffer amplifier is integrated on the carrier.

6. The DNA chip as claimed in claim 1 , wherein at least one of at least one sensor electrode and at least one shielding electrode are directly electrically isolated from the analyte.

7. The DNA chip as claimed in claim 1 , wherein a sensor electrode contains pointlike individual electrodes which are electrically connected to a buried electrode collective line by way of plated-through holes.

8. The DNA chip as claimed in claim 1 , wherein the thin-film microelectrode system is embedded in a reaction layer containing catcher molecules.

9. The DNA chip as claimed in claim 8 , wherein the thickness of the reaction layer is less than 100 μm and is correlated with the width of the electrodes or the interspaces thereof.

10. The DNA chip as claimed in claim 9 , wherein the width of the electrodes is approximately 1 μm, and the thickness of the reaction layer corresponds to approximately 5-10 times the value of the electrode width.

11. The DNA chip as claimed in claim 8 , wherein the reaction layer is a hydrogel.

12. The DNA chip as claimed in claim 1 , wherein the thin-film four-pole system forms an interdigital current electrode arrangement with double meandering current taps.

13. The DNA chip as claimed in claim 2 , wherein at least one sensor electrode is assigned a shielding electrode, which is held at the same electrical potential as the sensor electrode.

14. The DNA chip as claimed in claim 2 , wherein at least one of at least one sensor electrode and at least one shielding electrode are directly electrically isolated from the analyte.

15. The DNA chip as claimed in claim 2 , wherein a sensor electrode contains pointlike individual electrodes which are electrically connected to a buried electrode collective line by way of plated-through holes.

16. The DNA chip as claimed in claim 2 , wherein the thin-film microelectrode system is embedded in a reaction layer containing catcher molecules.

17. The DNA chip as claimed in claim 9 , wherein the reaction layer is a hydrogel.

18. The DNA chip as claimed in claim 2 , wherein the thin-film four-pole system forms an interdigital current electrode arrangement with double meandering current taps.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 18, 2014
From: SIEMENS AG
To: BOEHRINGER INGELHEIM VETMEDICA GMBH
Reel/Frame 033190/0899 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 25, 2009
From: INFINEON TECHNOLOGIES AG
To: SIEMENS AKTIENGESELLSCHAFT
Reel/Frame 023565/0819 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2006
From: SCHIENLE, MEINARD; THEWES, ROLAND; GUMBRECHT, WALTER; MUND, KONRAD
To: SIEMENS AKTIENGESELLSCHAFT; INFINEON TECHNOLOGIES AG
Reel/Frame 017751/0671 →
Priority Claims (1)
DE 102 59 820 · Dec 19, 2002 · national
Continuity (1)
Related Publication 20060216813A1 · Sep 28, 2006