IP Library Granted Patent US 7,474,383
Granted Patent B2
US 7,474,383 · App. 10/543,454 · Granted Jan 6, 2009

Mask making method, mask making device, and mask drawing device

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Quick Facts
Patent No.
US 7,474,383
App. No.
10/543,454
Granted
Jan 6, 2009
Kind
B2
Abstract

Laser light in a pattern reflected by a two-dimensional array micromirror 106 that is controlled on the basis of mask data of a mask pattern data output device 107 forms an enlarged pattern 110 . This enlarged pattern is projected in a reduced manner onto a mask substrate 109 through a reduction-projection optical system 102 , thereby forming a lithography pattern 111 . Since a large number of patterns are written in an instant by the two-dimensional array micromirror 106 , a time required for lithography the entire mask pattern is extremely shortened as compared with a conventional one. As a result, the mask cost can be largely reduced.

Claims (32)

1. A method of writing a mask for use in manufacturing a semiconductor device, comprising:

using a mask pattern projecting apparatus using light control elements arranged in a two-dimensional array;

controlling said light control elements based on mask pattern data to thereby enlarge a mask pattern into a first mask pattern which is enlarged in comparison with the mask pattern; and

reducing the first mask pattern into a reduced second mask pattern reduced in size in comparison with the first mask pattern by using a reduction-projection optical apparatus.

2. A method of writing a mask for use in manufacturing a semiconductor device according to claim 1 , characterized by using micromirrors arranged in a two-dimensional array as said light control elements.

3. A method of writing a mask for use in manufacturing a semiconductor device according to claim 1 , characterized by using self-light-emitting elements as said light control elements.

4. A method of writing a mask for use in manufacturing a semiconductor device according to claim 1 , characterized by using a liquid crystal display element or a reflector display element as said light control elements.

5. A method of writing a mask for use in manufacturing a semiconductor device according to claim 1 , characterized in that said first mask pattern is a spatial pattern.

6. A method of writing a mask for use in manufacturing a semiconductor device according to claim 1 , characterized by obtaining a proximity mask on the basis of said second mask pattern.

7. A method of writing a mask for use in manufacturing a semiconductor device, comprising:

using a mask pattern projecting apparatus using light control elements arranged in a two-dimensional array;

controlling said light control elements based on mask pattern data to enlarge a mask pattern into a first mask pattern which is enlarged in size in comparison with the mask pattern;

reducing the first mask pattern into a reduced second mask pattern reduced in size in comparison with the first mask pattern by using a first reduction-projection optical apparatus; and

further reducing the reduced second mask pattern into a further reduced third mask pattern by using a second reduction-projection optical apparatus.

8. A method of writing a mask for use in manufacturing a semiconductor device according to claim 7 , characterized by obtaining a proximity mask on the basis of said third mask pattern.

9. A method of writing a mask for use in manufacturing a semiconductor device according to claim 7 , characterized by using micromirrors arranged in a two-dimensional array as said light control elements.

10. A method of writing a mask for use in manufacturing a semiconductor device according to claim 7 , characterized by using self-light-emitting elements as said light control elements.

11. A method of writing a mask for use in manufacturing a semiconductor device according to claim 7 , characterized by using a liquid crystal display element or a reflector display element as said light control elements.

12. A method of writing a mask for use in manufacturing a semiconductor device according to claim 7 , characterized in that said first mask pattern is a spatial pattern.

13. A system for writing a mask for use in manufacturing a semiconductor device, comprising:

a mask pattern projecting apparatus using light control elements arranged in a two-dimensional array by controlling said light control elements based on mask pattern data to thereby enlarge a mask pattern into a first mask pattern enlarged in size in comparison with the mask pattern; and

a reduction-projection optical apparatus for reducing said first mask pattern into a reduced second mask pattern which is reduced in size in comparison with the first mask pattern.

14. A system for writing a mask for use in manufacturing a semiconductor device according to claim 13 , characterized by using micromirrors arranged in a two-dimensional array as said light control elements.

15. A system for writing a mask for use in manufacturing a semiconductor device according to claim 13 , characterized by using self-light-emitting elements as said light control elements.

16. A system for writing a mask for use in manufacturing a semiconductor device according to claim 13 , characterized by using a liquid crystal display element as said light control elements.

17. A system for writing a mask for use in manufacturing a semiconductor device, comprising:

a mask pattern projecting apparatus using light control elements arranged in a two-dimensional array by controlling said light control elements based on mask pattern data to thereby enlarge a mask pattern into a first mask pattern enlarged in size in comparison with the mask pattern;

a first reduction-projection optical apparatus for reducing said first mask pattern into a reduced second mask pattern which is reduced in size in comparison with the first mask pattern; and

a second reduction-projection optical apparatus for further reducing the reduced second mask pattern into a further reduced third mask pattern which is further reduced in size in comparison with the reduced second mask pattern.

18. A system for writing a mask for use in manufacturing a semiconductor device according to claim 17 , characterized by using micromirrors arranged in a two-dimensional array as said light control elements.

19. A system for writing a mask for use in manufacturing a semiconductor device according to claim 17 , characterized by using self-light-emitting elements as said light control elements.

20. A system for writing a mask for use in manufacturing a semiconductor device according to claim 17 , characterized by using a liquid crystal display element as said light control elements.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2007
From: BALL SEMICONDUCTOR INC.
To: TADAHIRO OHMI
Reel/Frame 019312/0095 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 29, 2005
From: OHMI, TADAHIRO
To: FOUNDATION FOR ADVANCEMENT OF INTERNATIONAL SCIENCE
Reel/Frame 017215/0184 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2005
From: OHMI, TADAHIRO; SUGAWA, SHIGETOSHI
To: OHMI,TADAHIRO; BALL SEMICONDUCTOR INC.
Reel/Frame 016925/0217 →