Electrical multilayered component and layer stack
A multilayer electrical component includes a plurality of ceramic layers disposed along an axis, a plurality of electrode layers disposed between the plurality of ceramic layers and in electrical contact with the ceramic layers, and a ceramic breach layer disposed between a first and a second ceramic layer of the plurality of ceramic layers along the axis. The ceramic breach layer has a lower breach stability than the plurality of ceramic layers with regard to tensile stresses in the direction of the axis.
1. A multilayer electrical component, comprising:
a plurality of ceramic layers disposed along an axis,
a plurality of electrode layers disposed among the plurality of ceramic layers, and
a ceramic breach layer disposed between a first and a second ceramic layer of the plurality of ceramic layers along the axis, the ceramic breach layer having a lower breach stability than the plurality of ceramic layers with regard to tensile stresses in the direction of the axis.
2. The component of claim 1 , wherein the breach layer comprises a material having a greater porosity than the plurality of ceramic layers.
3. The component of claim 1 , wherein the mutilayer electrical component comprises a monolithic component.
4. The component of claim 1 , further comprising a plurality of breach layers disposed at multiple points along the axis.
5. The component of claim 1 , wherein the plurality of electrode layers includes a first and a second electrode layer adjacent to the ceramic breach layer, the first and second electrode layers having an electrical polarity that is the same as one of the electrical polarities of the component.
6. The component of claim 1 , wherein a porosity of the breach layer is between about 1.2 and about 3 times greater than the porosity of the ceramic layers.
7. The component of claim 1 , wherein the breach layer comprises the same ceramic material as the ceramic layers.
8. The component of claim 1 , wherein the component comprises a piezoelectric actuator.
9. A layer stack, comprising:
a plurality of ceramic green films disposed in a stack, the plurality of ceramic green films comprising:
a ceramic powder, and
an organic bonding agent,
wherein at least one of the green films of the plurality of green films has an increased volumetric content of bonding agent compared to the other green films.
10. The layer stack of claim 9 , wherein the volumetric content of bonding agent in the at least one of the green films is increased by a factor of about 1.5 to about 3 times the volumetric content of bonding agent of at least some of the other green films.