IP Library › Patent Application 10548178
Patent Application
App. No. 10/548,178

Highly elastic epoxy resin composition

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Quick Facts
Patent No.
US None
App. No.
10/548,178
Abstract

An epoxy resin composition is disclosed which contains (A) 1-10 weight % of a polyvalent epoxy compound, (B) 1-10 weight % of a curing agent selected among cyanate compounds and benzoxazine compounds, (C) 0.1-5 weight % of a polyvalent phenolic compound and (D) 80-97.9 weight % of a spherical filler having an elastic modulus of 300 GPa or more. The epoxy resin composition has a void fraction of 3% or less and a high elastic modulus.

Claims (10)

1 . An epoxy resin composition which comprises (A) 1% to 10% by weight of a polyepoxy compound, (B) 1% to 10% by weight of a curing agent selected from a cyanate compound and a benzoxazine compound, (C) 0.1% to 5% by weight of a polyhydric phenol compound, and (D) 80% to 97.9% by weight of a spherical filler having an elastic modulus of 300 GPa or higher and has a void of 3% or less.

2 . The epoxy resin composition according to claim 1 , having a void of 1% or less.

3 . The epoxy resin composition according to claim 1 , which is obtained by mixing the components (A), (B), (C), and (D) and degassing the mixture by heating under reduced pressure.

4 . The epoxy resin composition according to claim 3 , wherein the degassing is carried out by heating the mixture at or above the melting points of the components (A) and (B) and below the curing temperature of the epoxy resin and evacuating to 1 mmTorr or lower.

5 . The epoxy resin composition according to claim 1 , wherein the component (B) is a polycyanate compound.

6 . The epoxy resin composition according to claim 1 , wherein the component (B) is a benzoxazine compound.

7 . The epoxy resin composition according to claim 1 , wherein the component (A) comprises 50% by weight or more of an epoxy compound represented by formula (I):

8 . The epoxy resin composition according to claim 1 , wherein the component (A) comprises 50% by weight or more of an epoxy compound represented by formula (II):

9 . The epoxy resin composition according to claim 1 , wherein the component (D) is alumina.

10 . A prepreg comprising the epoxy resin composition according to claim 1.

Assignments (2)
CHANGE OF NAME Recorded Jul 19, 2007
From: ASAHI DENKA CO., LTD.
To: ADEKA CORPORATION
Reel/Frame 019580/0097 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2005
From: TAKAHATA, YOSHINORI; MORI, TAKAHIRO; HIRAKAWA, SETSUKO; SAITO, SEIICHI
To: ASAHI DENKA CO., LTD.
Reel/Frame 017747/0593 →