IP Library › Granted Patent US 7,315,290
Granted Patent B2
US 7,315,290 · App. 10/562,928 · Granted Jan 1, 2008

Data communication apparatus

Assignee: Sony Corporation
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Quick Facts
Patent No.
US 7,315,290
App. No.
10/562,928
Granted
Jan 1, 2008
Kind
B2
Abstract

Disclosed is a data communication apparatus for non-contact data communication using electromagnetic induction. At least a portion of a conductor 5 a of the loop coil antenna ( 5 ) of the data communication apparatus, adapted for non-contact data communication, exploiting electromagnetic induction, is arranged for extending along the lateral side of an enclosure ( 2 a ) for equalizing the sensitivity of the loop coil antenna ( 5 ) across both major surfaces of the enclosure ( 2 a ).

Claims (14)

1. A data communication apparatus comprising:

an enclosure;

a mobile phone function unit arranged in said enclosure;

a loop coil antenna arranged so that at least a portion of a conductor extends along the peripheral of lateral surfaces, said lateral surfaces forming said enclosure with the exclusion of both major surfaces of the enclosure; and

a semiconductor integrated circuit connected to said loop coil antenna, said semiconductor integrated circuit carrying out non-contact data communication over said loop coil antenna with an exterior communication device by using electromagnetic induction and/or a reader writer function.

2. The data communication apparatus according to claim 1 wherein said conductor is arranged for extending along the entire periphery of said enclosure.

3. The data communication apparatus according to claim 1 wherein said loop coil antenna is of a three-dimensional shape, with said conductor being mounted for extending spirally along the lateral surfaces of said enclosure.

4. The data communication apparatus according to claim 3 wherein said loop coil antenna is formed by forming a plurality of patterned linear copper foils on a major surface of a flexible insulating substrate along a direction perpendicular to the longitudinal direction of said insulating substrate.

5. The data communication apparatus according to claim 1 wherein said loop coil antenna is formed by being embedded in a lateral surface of said enclosure.

6. The data communication apparatus according to claim 1 wherein said loop coil antenna is formed by a first loop coil antenna, electrically connected to a non-contact IC card circuit part, implementing the non-contact IC card function of said semiconductor integrated circuit, and a second loop coil antenna, electrically connected to a reader/writer circuit part, implementing the reader/writer function of said semiconductor integrated circuit, and wherein both of said first loop coil antenna and the second loop coil antenna are arranged on the lateral side of said enclosure.

7. The data communication apparatus according to claim 6 wherein said enclosure includes a main body part and a display part mounted for opening/closure relative to said main body part.

8. The data communication apparatus according to claim 7 wherein one of said first and second loop coil antennas is arranged in said main body part of said enclosure and the other of said first and second loop coil antennas is arranged in said display part thereof.

9. The data communication apparatus according to claim 7 wherein both of said first and second loop coil antennas are arranged in said main body part of said enclosure.

10. The data communication apparatus according to claim 7 wherein both of said first and second loop coil antennas are arranged in said display part of said enclosure.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2005
From: HARADA, SETSUO; EZAKI, TADASHI
To: SONY CORPORATION
Reel/Frame 017493/0792 →
Priority Claims (1)
JP 2003-188462 · Jun 30, 2003 · national
Continuity (1)
Related Publication 20060192723A1 · Aug 31, 2006