IP Library Granted Patent US 8,231,728
Granted Patent B2
US 8,231,728 · App. 10/563,105 · Granted Jul 31, 2012

Epitaxial growth process

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Quick Facts
Patent No.
US 8,231,728
App. No.
10/563,105
Granted
Jul 31, 2012
Kind
B2
Abstract

An epitaxial growth method forming a semiconductor thin film including a heterojunction of a group III-V compound semiconductor by means of molecular beam epitaxy. The method is configured to include: a first step of irradiating a molecular beam of at least one of group III elements and a molecular beam of a first group V element to form a first compound semiconductor layer; a second step of stopping the irradiation of the molecular beam of the group III element and the molecular beam of the first group V element to halt growth until an amount of the first group V element supplied is reduced to 1/10 or less of a supply of the first group V element in the first step; and a third step of irradiating a molecular beam of at least one of the group III elements and a molecular beam of a second group V element to form a second compound semiconductor layer, which is different from the first compound semiconductor, on the first compound semiconductor layer.

Claims (14)

1. An epitaxial growth method to form a semiconductor thin film including a heterojunction of a group III-V compound semiconductor by means of molecular beam epitaxy, the method comprising:

a first step of irradiating a molecular beam of at least one of group III elements and a molecular beam of a first group V element to form a first compound semiconductor layer;

a second step of stopping the irradiation of the molecular beam of the group III element and the molecular beam of the first group V element, starting an irradiation of a molecular beam of a second group V element at the same time, and halting growth for a period of time until a remaining molecular beam intensity of the first group V element is reduced to be in the range of 0.01 to 0.1 of that in the first step; and

a third step of restarting an irradiation of a molecular beam of at least one of the group III elements to form an etch stopper layer on the first compound semiconductor layer, the etch stopper layer being composed of the second compound semiconductor layer which is different from the first compound semiconductor,

wherein the semiconductor thin film comprises a high electron mobility transistor structure.

2. An epitaxial growth method to form a semiconductor thin film including a heterojunction of a group III-V compound semiconductor by means of molecular beam epitaxy, the method comprising:

a first step of irradiating a molecular beam of at least one of group III elements and a molecular beam of a first group V element to form a first compound semiconductor layer;

a second step of stopping the irradiation of the molecular beam of the group III element and the molecular beam of the first group V element, starting an irradiation of a molecular beam of a second group V element at the same time, and halting growth for a period of time until a remaining molecular beam intensity of the first group V element is reduced to be in the range of 0.01 to 0.1 of that in the first step; and

a third step of further restarting an irradiation of a molecular beam of at least one of the group III elements in addition to continuously irradiating the molecular beam of the second group V element to form an etch stopper layer on the first compound semiconductor layer, the etch stopper layer being composed of the second compound semiconductor layer which is different from the first compound semiconductor,

wherein the semiconductor thin film comprises a high electron mobility transistor structure.

3. The epitaxial growth method as claimed in claim 1 ,

wherein the first compound semiconductor layer is any one of an InAlAs layer and an InGaAs layer and the second compound semiconductor layer is any one of an InP layer and an InGaP layer.

4. The epitaxial growth method as claimed in claim 2 ,

wherein the first compound semiconductor layer is any one of an InAlAs layer and an InGaAs layer and the second compound semiconductor layer is any one of an InP layer and an InGaP layer.

Assignments (5)
CHANGE OF ADDRESS OF ASSIGNEE Recorded Jun 2, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042669/0315 →
CHANGE OF NAME Recorded May 29, 2017
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042521/0717 →
MERGER Recorded May 13, 2017
From: NIPPON MINING & METALS CO., LTD
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 042369/0356 →
CHANGE OF NAME Recorded Sep 18, 2006
From: NIKKO MATERIALS CO., LTD.
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 018268/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 30, 2005
From: TAKAKUSAKI, MISAO; KANAI, SUSUMU
To: NIKKO MATERIALS CO., LTD.
Reel/Frame 017402/0809 →