Highly pure hafnium material, target thin film comprising the same and method for producing highly pure hafnium
View Patent ↗Provided is a manufacturing method of high purity hafnium including the steps of making aqueous solution of chloride of hafnium, thereafter removing zirconium therefrom via solvent extraction, performing neutralization treatment to obtain hafnium oxide, further performing chlorination to obtain hafnium chloride, obtaining hafnium sponge via reducing said hafnium chloride, and performing electron beam melting to the hafnium sponge in order to obtain a hafnium ingot, as well as a high purity hafnium material obtained thereby and a target and thin film formed from such material. The present invention relates to a high purity hafnium material with reduced zirconium content contained in the hafnium, a target and thin film formed from such material, and the manufacturing method thereof, and provides efficient and stable manufacturing technology, a high purity hafnium material obtained according to such manufacturing technology, and a target and high purity hafnium thin film formed from such material.
1. A sputtering target or thin film formed therefrom comprising a sputtering target or thin film made of a high purity hafnium material, wherein a zirconium content of the target or thin film is 1 to 1000 wtppm, a purity of the target or thin film is 4N5 to 6N excluding gas components of carbon, oxygen and nitrogen, and the contents of oxygen being 500 wtppm or less, nitrogen and carbon being respectively 100 wtppm or less, and iron, chromium and nickel being respectively 10 wtppm or less.
2. A sputtering target or thin film according to claim 1 , wherein said purity of the target or thin film is 6N.
3. A hafnium sputtering target comprising:
a sputtering target body consisting of high purity hafnium of a purity of at least 4N5 (99.995 wt %) excluding zirconium content and gas components of carbon, oxygen and nitrogen;
said high purity hafnium having a zirconium content of 1 to 1000 wtppm, an oxygen content of 500 wtppm or less, a nitrogen content of 100 wtppm or less, a carbon content of 100 wtppm or less, an iron content of 10 wtppm or less, a chromium content of 10 wtppm or less, and a nickel content of 10 wtppm or less; and
said sputtering target body having a forged and rolled microstructure having been subject to forging and rolling processing.
4. A hafnium sputtering target according to claim 3 , wherein said purity is 6N (99.9999 wt %).
5. A hafnium sputtering target according to claim 3 , wherein said zirconium content throughout said sputtering target body is 1 to 200 wtppm.
6. A thin film formed from sputtering a hafnium sputtering target comprising:
a thin film consisting of high purity hafnium of a purity of at least 4N5 (99.995 wt %) excluding zirconium content and gas components of carbon, oxygen and nitrogen;
said high purity hafnium having a zirconium content of 1 to 1000 wtppm, an oxygen content of 500 wtppm or less, a nitrogen content of 100 wtppm or less, a carbon content of 100 wtppm or less, an iron content of 10 wtppm or less, a chromium content of 10 wtppm or less, and a nickel content of 10 wtppm or less.
7. A thin film according to claim 6 , wherein said purity is 6N (99.9999 wt %).
8. A thin film according to claim 7 , wherein said zirconium content is 1 to 200 wtppm.