IP Library Granted Patent US 7,537,944
Granted Patent B2
US 7,537,944 · App. 10/570,627 · Granted May 26, 2009

Method for manufacturing p-type group III nitride semiconductor, and group III nitride semiconductor light-emitting device

Assignee: Showa Denko K.K.
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Quick Facts
Patent No.
US 7,537,944
App. No.
10/570,627
Granted
May 26, 2009
Kind
B2
Abstract

An object of the present invention is to provide an efficient method for manufacturing a p-type group III nitride semiconductor that has adequate carrier concentration and a surface with a low occurrence of crystal damage. The inventive method for manufacturing a p-type group III nitride semiconductor comprises: (a) growing a group III nitride semiconductor containing a p-type dopant at 1000° C. or higher in an atmosphere containing H 2 gas and/or NH 3 gas; and (b) after the growth of the group III nitride semiconductor, substituting the H 2 gas and NH 3 gas with an inert gas at a temperature higher than 800° C. while reducing the temperature.

Claims (6)

1. A method for manufacturing a p-type group III nitride semiconductor comprising:

(a) growing a group III nitride semiconductor containing a p-type dopant at a temperature of 1000° C. or higher in an atmosphere containing H 2 gas and/or NH 3 gas; and

(b) after the growth of the group III nitride semiconductor, substituting the H 2 gas and NH 3 gas with an inert gas at the temperature of 900° C. or more while reducing the temperature at 0.5° C./second or faster without maintaining a constant temperature during reducing the temperature and after the temperature is reduced 50° C. or more from the temperature maintained during the growth of the group III nitride semiconductor.

2. The method for manufacturing a p-type group III nitride semiconductor according to claim 1 , wherein the temperature during growth of the group III nitride semiconductor is 1050° C. or more, and the substitution with the inert gas is carried out at 1000° C. or more.

3. The method for manufacturing a p-type group III nitride semiconductor according to claim 1 , wherein the group III nitride is represented by the formula Al x In y Ga 1-x-y (wherein x=0 to 0.5 and y=0 to 0.1).

4. The method for manufacturing a p-type group III nitride semiconductor according to claim 1 , wherein the p-type group III nitride semiconductor contains magnesium as the p-type dopant.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2006
From: KOBAYAKAWA, MASATO
To: SHOWA DENKO K.K.
Reel/Frame 017650/0930 →
Priority Claims (1)
JP 2003-374478 · Nov 4, 2003 · national
Continuity (2)
Provisional Application 6051963600 · Nov 14, 2003
Related Publication 20070090369A1 · Apr 26, 2007