IP Library Granted Patent US 8,134,168
Granted Patent B2
US 8,134,168 · App. 10/575,625 · Granted Mar 13, 2012

Group-III nitride semiconductor device

Assignee: Showa Denko K.K.
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Quick Facts
Patent No.
US 8,134,168
App. No.
10/575,625
Granted
Mar 13, 2012
Kind
B2
Abstract

An object of the present invention is to provide a Group III nitride semiconductor element which comprises a thick AlGaN layer exhibiting high crystallinity and containing no cracks, and which does not include a thick GaN layer (which generally serves as a light-absorbing layer in an ultraviolet LED). The inventive Group III nitride semiconductor element comprises a substrate; a first nitride semiconductor layer composed of AlN which is provided on the substrate; a second nitride semiconductor layer composed of Al x1 Ga 1-x1 N (0≦x1≦0.1) which is provided on the first nitride semiconductor layer; and a third nitride semiconductor layer composed of Al x2 Ga 1-x2 N (0<x2<1 and x1+0.02≦x2) which is provided on the second nitride semiconductor layer.

Claims (25)

1. A Group III nitride semiconductor element comprising

a substrate;

a first nitride semiconductor layer composed of AlN single crystal having a thickness of 0.005 to 0.5 μm which is provided on the substrate;

a second nitride semiconductor layer composed of Al x1 Ga 1-x1 N(0<x1≦0.05) which is provided on the first nitride semiconductor layer;

a third nitride semiconductor layer composed of Al x2 Ga 1-x2 N(x1+0.02≦x2≦0.5) which is provided on the second nitride semiconductor layer; and

a fourth nitride semiconductor layer which is provided on the third nitride semiconductor layer, the fourth nitride semiconductor layer including:

an n-type contact layer composed of Al a Ga 1-a N (0<a<1),

an n-type cladding layer composed of Al b Ga 1-b N (0<b<0.4) which is provided on the n-type contact layer, and

a light-emitting layer which has a multiple quantum well (MQW) structure including a well layer composed of Ga 1-s In s N (0<s<0.1) and a barrier layer composed of Al c Ga 1-c N c (0≦c<0.3 and c<b) doped with Si, and is provided on the n-type cladding layer.

2. A Group III nitride semiconductor element according to claim 1 , wherein said substrate is selected from a group consisting of sapphire single crystal, Si single crystal, SiC single crystal, AlN single crystal, and GaN single crystal.

3. A Group III nitride semiconductor element according to claim 1 , wherein said second nitride semiconductor layer is formed of an island-like structure in which crystals of different heights are arranged so as to be separated from one another.

4. A Group III nitride semiconductor element according to claim 3 , wherein the Al content of said second nitride semiconductor layer differs from region to region of the island-like structure.

5. A Group III nitride semiconductor element according to claim 4 , wherein the second nitride semiconductor layer has a region having a lower Al content at a position closer to the substrate and a higher Al content at a position farther from the substrate.

6. A Group III nitride semiconductor element according to claim 1 , wherein said second nitride semiconductor layer is composed of Al x1 Ga 1-x1 N(0<x1≦0.02).

7. A Group III nitride semiconductor element according to claim 1 , wherein said second nitride semiconductor layer has a thickness of 1 to 500 nm.

8. A Group III nitride semiconductor element according to claim 7 , wherein said second nitride semiconductor layer has a thickness of 1 to 400 nm.

9. A Group III nitride semiconductor element according to claim 8 , wherein said second nitride semiconductor layer has a thickness of 1 to 300 nm.

10. A Group III nitride semiconductor element according to claim 1 , wherein said second nitride semiconductor layer is composed of an undoped semiconductor.

11. A Group III nitride semiconductor light-emitting device comprising a Group III nitride semiconductor element according to claim 1 , wherein:

the fourth nitride semiconductor layer further includes a p-type layer provided on said a light-emitting layer,

a negative electrode provided on said n-type contact layer; and

a positive electrode provided on said p-type layer.

12. A light-emitting diode comprising a Group III nitride semiconductor light-emitting device according to claim 11 .

13. A laser diode comprising a Group III nitride semiconductor light-emitting device according to claim 11 .

14. A semiconductor device comprising a Group III nitride semiconductor element according to claim 1 .

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 13, 2006
From: SAKAI, HIROMITSU; OKUYAMA, MINEO
To: SHOWA DENKO K.K.
Reel/Frame 017950/0579 →
Priority Claims (1)
JP 2003-354237 · Oct 14, 2003 · national
Continuity (2)
Provisional Application 60513596 · Oct 24, 2003
Related Publication 20070126009A1 · Jun 7, 2007