Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof
A gallium nitride-based compound semiconductor light-emitting device which includes an n-type semiconductor layer of a gallium nitride-based compound semiconductor, a light-emitting layer of a gallium nitride-based compound semiconductor and a p-type semiconductor layer of a gallium nitride-based compound semiconductor formed on a substrate in this order, and has a negative electrode and a positive electrode provided on the n-type semiconductor layer and the p-type semiconductor layer, respectively; wherein the negative electrode includes a bonding pad layer and a contact metal layer which is in contact with the n-type semiconductor layer, and the contact metal layer is composed of Cr or a Cr alloy and formed through sputtering.
1. A method for manufacturing a gallium nitride-based compound semiconductor light-emitting device comprising
(a) forming an n-type semiconductor layer of a gallium nitride-based compound semiconductor, a light-emitting layer of a gallium nitride-based compound semiconductor and a p-type semiconductor layer of a gallium nitride-based compound semiconductor on a substrate in this order,
(b) providing a positive electrode and a negative electrode, which comprises a bonding pad layer and a contact metal layer, on the p-type semiconductor layer and the n-type semiconductor layer, respectively;
wherein the contact metal layer is forming through sputtering Cr or a Cr alloy on the n-type semiconductor layer to attain Ohmic contact without performing annealing.