IP Library Granted Patent US 7,655,491
Granted Patent B2
US 7,655,491 · App. 10/585,999 · Granted Feb 2, 2010

P-type Group III nitride semiconductor and production method thereof

Assignee: Showa Denko K.K.
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,655,491
App. No.
10/585,999
Granted
Feb 2, 2010
Kind
B2
Abstract

An object of the present invention is to provide a method for producing a p-type Group III nitride semiconductor which can be used to produce a light-emitting device exhibiting a low operation voltage and a sufficiently high reverse voltage. The inventive method for producing a p-type Group III nitride semiconductor comprises, during lowering temperature after completion of growth of a Group III nitride semiconductor containing a p-type dopant, immediately after completion of the growth, starting, at a temperature at which the growth has been completed, supply of a carrier gas composed of an inert gas and reduction of the flow rate of a nitrogen source; and stopping supply of the nitrogen source at a time in the course of lowering the temperature.

Claims (6)

1. A method for producing a Group III nitride semiconductor light-emitting device having an n-type contact layer, a light-emitting layer and a p-type contact layer on a substrate, wherein the method comprises, during lowering temperature after completion of growth of the p-type contact layer composed of AlGaN containing a p-type dopant,

immediately after the completion of the growth, starting, at a temperature at which the growth has been completed, supply of a carrier gas composed of an inert gas and reduction of a flow rate of a nitrogen source, wherein the flow rate of the nitrogen source after the reduction is 0.001% to 10% with respect to a flow rate of the total volume of gas; and

stopping supply of the nitrogen source at 700° C. to 950° C. in the course of lowering temperature.

2. A production method according to claim 1 , wherein the temperature when the growth has been completed is 900° C. or higher.

3. A production method according to claim 1 , wherein the nitrogen source is ammonia gas.

4. A production method according to claim 1 , wherein a carrier gas employed during growth of the semiconductor contains hydrogen gas.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2012
From: SHOWA DENKO KABUSHIKI KAISHA
To: TOYODA GOSEI CO., LTD.
Reel/Frame 029489/0249 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2006
From: MIKI, HISAYUKI; TAKEDA, HITOSHI
To: SHOWA DENKO K.K.
Reel/Frame 018114/0413 →
Priority Claims (1)
JP 2004-142657 · May 12, 2004 · national
Continuity (2)
Provisional Application 6057226900 · May 19, 2004
Related Publication 20080246053A1 · Oct 9, 2008