System and method for the fabrication of an electro-optical module

1. A hybrid module comprising:

an electro-optical component for transmitting or receiving energy;

an electronic component for amplifying and transferring an electric signal to said electro-optical component;

a planar light wave circuit formed of a glass layer for providing an opto-electronic signal communication path; and

an optical waveguide embedded in and integrally formed with said glass layer forming said planar light wave circuit for propagating said opto-electronic signal communication,

wherein the hybrid module is a glass-based packageless non-PCB module;

wherein the optical waveguide is a glass-based mono-layer optical waveguide formed of a single layer of a single uncoated non-etched material;

wherein a first edge of the optical waveguide, located in proximity to the electro-optical component, is tapered to improve the connection between the optical waveguide and the electro-optical component, and a second edge of the optical waveguide is non-tapered;

wherein the hybrid module further comprises an optical fiber connector for direct connection to an external optical fiber, wherein the optical fiber connector is polished at an angle;

wherein the electro-optical component and the electronic component are enclosed in a heat sink encapsulation to dissipate heat.

2. A hybrid module as in claim 1 , further comprising an optical fiber plug connector.

3. A hybrid module as in claim 1 , further comprising an embedded folding micro-mirror embedded in said planar light wave circuit for directing energy transfer between said electro-optical component and said optical waveguide.

4. A hybrid module as in claim 1 , herein said heat sink encapsulation comprises a metal cap.

5. A hybrid module as in claim 1 , wherein said electro-optical component is coupled to said electronic component.

6. A hybrid module as in claim 3 , wherein said electro-optical component is coupled to said waveguide through said embedded folding micro-mirror.

7. A hybrid module as in claim 1 , wherein said electro-optical component comprises a current amplifier for amplifying weak signals.

8. A method comprising:

fabricating a waveguide glass wafer;

producing a support glass wafer;

creating optical chips by attaching said support glass wafer to said waveguide glass wafer;

creating an electro-optical modules wafer by attaching electro-optical components to said waveguide glass wafer,

wherein the created electro-optical modules wafer comprises at least one electro-optical module which is a glass-based packageless non-PCB module comprising:

wherein the optical waveguide is a glass-based mono-layer optical waveguide formed of a single layer of a single uncoated non-etched material;

wherein a first edge of the optical waveguide, located in proximity to the electro-optical component, is tapered to improve the connection between the optical waveguide and the electro-optical component, and a second edge of the optical waveguide is non-tapered;

wherein the hybrid module further comprises an optical fiber connector for direct connection to an external optical fiber, wherein the optical fiber connector is polished at an angle

wherein the electro-optical component and the electronic component are enclosed in a heat sink encapsulation to dissipate heat.

9. A method as in claim 8 , wherein said fabricating said waveguide glass wafer further comprises:

creating a plurality of waveguides using ion exchange technology in said waveguide glass wafer forming a planar lightwave circuit;

printing electric lines and contacts on said waveguide glass wafer;

dicing a slot in said waveguide glass wafer; and

filling said slot in said waveguide glass wafer with a light-reflecting metal forming a micro-mirror.

10. A method as in claim 8 , wherein said producing said support glass wafer further comprises:

creating a plurality of vias on a glass substrate; coating said vias with a conductive material; and

printing electrical lines and contacts on both sides of said support glass wafer.

11. A method as in claim 10 , wherein said creating said plurality of vias comprises creating by wet or dry etching.

12. A method as in claim 9 , wherein said creating said optical chip further comprises:

dicing said electro-optical modules wafer at one side to be connected to create double bars;

polishing said fiber optic connector side; and

attaching pig-tail fibers at an end of each of said plurality of waveguides.

13. A method as in claim 8 , wherein said electro-optical components are attached to said optical chip using an active alignment beam.

14. A method as in claim 12 , wherein said creating said electro-optical module further comprises:

encapsulating said electro-optical components and electronic components with a thermal conductive polymer; and

dicing said double bars to create said separate electro-optical modules.

15. A hybrid module as in claim 1 , wherein said electro-optical component is mounted on said glass layer forming said planar light wave circuit.

16. A hybrid module as in claim 1 , wherein said at least one optical waveguide is formed as a region of ion exchange within a waveguide glass wafer.