Light-emitting diode arrangement for a high-power light-emitting diode and method for producing a light-emitting diode arrangement

1. A light emitting diode arrangement, comprising:

a flexible circuit board comprising electrical conductor tracks and a thermally conductive layer;

a plurality of sections, wherein each section has a single high power light-emitting diode, an associated pair of electrical contact areas, an associated pair of electrical connection locations, a plurality of first electrical conductor tracks, and a plurality of second electrical conductor tracks;

a plurality of thermally conductive layers separated from each other; and

a plurality of high power light-emitting diodes,

wherein the electrical contact areas and the electrical connection locations of a same section are electrically connected to one another by the first electrical conductor tracks, and

wherein the electrical connection locations of neighboring sections are electrically connected to one another by the second electrical conductor tracks; and

wherein each high power light emitting diode is mounted onto said flexible circuit board and in thermal contact with the thermally conductive layer, the high power light emitting diode including a thermal connection part in thermal contact with the thermally conductive layer;

wherein the thermally conductive layer and the electrical conductor tracks are positioned in a same plane of the flexible circuit board; and

wherein the thermally conductive layer occupies at least 60% of an area of said same plane.

2. The light emitting diode arrangement as claimed in claim 1 , wherein the high power light emitting diode has a power consumption of at least 300 mW.

3. The light emitting diode arrangement as claimed in claim 1 , wherein the high power light emitting diode is soldered onto the flexible circuit board.

4. The light emitting diode arrangement as claimed in claim 3 , wherein the flexible circuit board contains at least one flexible carrier layer.

5. The light emitting diode arrangement as claimed in claim 4 , wherein the flexible carrier layer contains at least one of the following materials: polyimide, polyethylene naphthalate, polyester, FR4.

6. The light emitting diode arrangement as claimed in claim 1 , wherein the thermally conductive layer contains a metal.

7. The light emitting diode arrangement as claimed in claim 1 , wherein the thermally conductive layer contains copper.

8. The light emitting diode arrangement as claimed in claim 1 , wherein the at least one high power light emitting diode is soldered onto the thermally conductive layer.

9. The light emitting diode arrangement as claimed in claim 1 , wherein the thermally conductive layer and the electrical conductor tracks contain the same metal.

10. The light emitting diode arrangement as claimed in claim 1 , wherein an insulating layer is applied to a surface of the flexible circuit board.

11. The light emitting diode arrangement as claimed in claim 10 , wherein the insulating layer includes cutouts for making electrical and thermal contact with the high power light emitting diode.

12. The light emitting diode arrangement as claimed in claim 10 , wherein the insulating layer contains a soldering resist.

13. The light emitting diode arrangement as claimed in claim 1 , wherein that side of the flexible circuit board which is remote from the at least one high power light emitting diode includes an adhesive-containing layer.

14. The light emitting diode arrangement as claimed in claim 13 , wherein the adhesive-containing layer is formed by a double sided adhesive tape.

15. The light emitting diode arrangement as claimed in claim 13 , wherein the adhesive-containing layer is heat-resistant up to temperatures of 250° C.

16. The light emitting diode arrangement as claimed in claim 13 , wherein the adhesive-containing layer has a thickness of at most 60 μm.

17. The light emitting diode arrangement as claimed in claim 13 , wherein the adhesive-containing layer is covered with a protective film.

18. The light emitting diode arrangement as claimed in claim 17 , wherein the protective film contains a plastic.

19. The light emitting diode arrangement as claimed in claim 1 , further comprising:

a multiplicity of high power light emitting diodes which are connected in series.

20. The light emitting diode arrangement as claimed in claim 19 , further comprising:

a pair of contact areas for each high power light emitting diode of the multiplicity of high power light emitting diodes.

21. The light emitting diode arrangement as claimed in claim 20 , further comprising:

sections, each section having a high power light emitting diode and the associated pair of contact areas.

22. The light emitting diode arrangement as claimed in claim 21 , wherein the sections are arranged as repeating structures.

23. The light emitting diode arrangement as claimed in claim 22 , wherein the sections are arranged in a series.

24. The light emitting diode arrangement as claimed in claim 1 , further comprising:

at least one additional thermally conductive layer separated from the thermally conductive layer;

wherein each of the thermally conductive layer and the additional thermally conductive layer is connected to a respective single light-emitting diode.

25. An illumination device, having a light emitting diode arrangement as claimed in claim 1 , and a heat sink on which the light emitting diode arrangement is applied.

26. The illumination device as claimed in claim 25 , in which the light emitting diode arrangement is adhesively bonded onto the heat sink.

27. The illumination device as claimed in claim 25 , in which the heat sink contains a metal.

28. The illumination device as claimed in claim 25 , in which the lamp housing is the housing for one of the following lamps: automobile interior illumination, automobile rear illumination, brake light, flashing indicator.

29. The illumination device as claimed in claim 28 , in which the heat sink is part of a lamp housing.

30. A light emitting diode arrangement, comprising:

a flexible circuit board comprising electrical conductor tracks and a thermally conductive layer; and

at least one high power light emitting diode mounted onto said flexible circuit board and in thermal contact with the thermally conductive layer;

wherein the thermally conductive layer and the electrical conductor tracks are positioned in a same plane of the flexible circuit board;

wherein the thermally conductive layer occupies at least 60% of an area of said same plane; and

wherein the thermally conductive layer is free of a region which forms a stripe or a rectangle.

31. The light emitting diode arrangement as claimed in claim 30 , wherein the thermally conductive layer has an essentially round form.

32. The light emitting diode arrangement as claimed in claim 30 , wherein the thermally conductive layer includes at least one recess or concave region which partially surrounds at least one of the electrical conductor tracks.

33. A light emitting diode arrangement, comprising:

a flexible circuit board comprising electrical conductor tracks and a thermally conductive layer;

a plurality of sections, wherein each section has a single high power light-emitting diode, an associated pair of electrical contact areas, an associated pair of electrical connection locations, a plurality of first electrical conductor tracks, and a plurality of second electrical conductor tracks;

a plurality of thermally conductive layers separated from each other; and

a plurality of high power light-emitting diodes,

wherein the electrical contact areas and the electrical connection locations of a same section are electrically connected to one another by the first electrical conductor tracks, and

wherein the electrical connection locations of neighboring sections are electrically connected to one another by the second electrical conductor tracks; and

wherein each high power light emitting diode is mounted onto said flexible circuit board and in thermal contact with the thermally conductive layer, the at least one high power light emitting diode including a thermal connection part in thermal contact with the thermally conductive layer, and the thermal contact being producible by soldering the thermal connection part of the high power light emitting diode onto the thermally conductive layer;

wherein the thermally conductive layer and the electrical conductor tracks are positioned in a same plane of the flexible circuit board; and

wherein the thermally conductive layer occupies at least 60% of an area of said same plane.

34. A light emitting diode arrangement, comprising:

a flexible circuit board comprising electrical conductor tracks and a plurality of thermally conductive layers, the plurality of thermally conductive layers and the electrical conductor tracks being positioned in a same plane of the flexible circuit board;

wherein the light emitting diode arrangement is divided into sections, said sections each including a high power light emitting diode mounted onto an associated flexible circuit board, an associated pair of electrical contact areas and a thermally conductive layer;

wherein the associated pair of contact areas are provided for the high power light emitting diode;

wherein the thermally conductive layers of each different section of the sections are spatially separated from each other;

wherein the light emitting diode arrangement is separable along lines between each of the plurality of thermally conductive layers to create individual sections which each include the high power light emitting diode, the associated pair of electrical contact areas and the thermally conductive layer;

wherein the high power light emitting diode is in thermal contact with the thermally conductive layer; and

wherein the thermally conductive layer occupies at least 60% of an area of the associated flexible circuit board.