NI-PT ALLOY AND TARGET COMPRISING THE ALLOY
The present invention provides a Ni—Pt alloy superior in workability containing Pt in a content of 0.1 to 20 wt % and having a Vickers hardness of 40 to 90, and a target comprising the Ni—Pt alloy. The present invention also provides a manufacturing method of Ni—Pt alloy superior in workability comprising a step of subjecting a raw material Ni having a purity of 3N level to electrochemical dissolution, a step of neutralizing the electrolytically leached solution with ammonia, a step of removing impurities through filtration with activated carbon, a step of blowing carbon dioxide into the resultant solution to form nickel carbonate and exposing the resultant product to a reducing atmosphere to prepare high purity Ni powder, a step of leaching a raw material Pt having a purity of 3N level with acid, a step of subjecting the leached solution to electrolysis to prepare high purity electrodeposited Pt, and a step of dissolving the resultant high purity Ni powder and high purity electrodeposited Pt. The foregoing method enables the rolling of the Ni—Pt alloy ingot upon reducing the hardness thereof, which results in the stable and efficient manufacture of a rolled target.
1 . A Ni—Pt alloy superior in workability containing Pt in a content of 0.1 to 20 wt % and having a Vickers hardness of 40 to 90.
2 . The Ni—Pt alloy according to claim 1 having a purity of 99.99% or higher.
3 . A method of manufacturing Ni—Pt alloy superior in workability, comprising the steps of:
subjecting a raw material Ni having a purity of 3N level to electrochemical dissolution,
neutralizing the electrolytically leached solution with ammonia,
removing impurities by filtering the neutralized solution with activated carbon,
blowing carbon dioxide into the resultant solution to form nickel carbonate and exposing the resultant product to a reducing atmosphere to prepare high purity Ni powder,
leaching a raw material Pt having a purity of 3N level with acid,
subjecting the leached solution to electrolysis to prepare high purity electrodeposited Pt, and
dissolving the resultant high purity Ni powder and high purity electrodeposited Pt.
4 . The method according to claim 3 , wherein the Ni—Pt alloy has a purity of 99.99% or higher.
5 - 6 . (canceled)
7 . A Ni—Pt alloy target superior in workability containing Pt in a content of 0.1 to 20 wt % and having a Vickers hardness of 40 to 90.
8 . The Ni—Pt alloy target according to claim 7 having a purity of 99.99% or higher.
9 . A method according to claim 4 , wherein the Ni—Pt alloy has Pt in a content of 0.1 to 20 wt % and has a Vickers hardness of 40 to 90.
10 . A method according to claim 9 , further comprising the step of manufacturing a Ni—Pt alloy sputtering target from the high purity Ni powder and high purity electrodeposited Pt after said dissolving step.
11 . A method according to claim 3 , wherein the Ni—Pt alloy has Pt in a content of 0. 1 to 20 wt % and has a Vickers hardness of 40 to 90.
12 . A method according to claim 11 , further comprising the step of manufacturing a Ni—Pt alloy sputtering target from the high purity Ni powder and high purity electrodeposited Pt after said dissolving step.
13 . A method according to claim 3 , further comprising the step of manufacturing a Ni—Pt alloy sputtering target from the high purity Ni powder and high purity electrodeposited Pt after said dissolving step.