Imaging system for a microlithographical projection light system

1. An imaging system comprising:

a projection objective that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane; and

a liquid-delivery device serving to fill immersion liquid into an interstitial space between the image plane and a last optical element on the image-plane side of the projection objective;

wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane;

wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane; and

wherein the imaging system is configured to be used in a microlithographic projection exposure apparatus, the image-plane-facing surface of the last optical element is shaped on the image-plane side at least substantially like a spherical shell, and the curvature radius of the image-plane-facing surface of the last optical element on the image-plane side is between 0.9 and 1.5 times as large as the axial distance between the last optical element on the image-plane side and the image plane.

2. The imaging system according to claim 1 , wherein the last optical element on the image-plane side has a concave-curved surface facing in the direction towards the image plane and bordering on the immersion liquid.

3. The imaging system according to claim 2 , wherein the concave-curved surface of the last optical element on the image-plane side extends over an area that substantially fills out the entire contour dimensions of the last optical element as measured parallel to the image plane.

4. The imaging system according to claim 1 , wherein a substrate holder is provided which can be selectively actuated to apply a holding force for holding a substrate carrying the light-sensitive coating in an exposure position above the last optical element on the image-plane side.

5. The imaging system according to claim 4 , wherein the substrate holder is equipped with a vacuum suction device.

6. The imaging system according to claim 1 , wherein a rotator is provided which serves to rotate a substrate carrying the light-sensitive coating between a transport orientation in which the light-sensitive coating lies on a substrate surface that faces against the direction of gravity and an exposure orientation in which the light-sensitive coating lies on a substrate surface that faces in the direction of gravity.

7. The imaging system according to claim 6 , wherein the rotator is designed to perform the turning over of individual wafers which can be taken out of and returned to a wafer-tracking device.

8. The imaging system according to claim 6 , wherein the rotator is designed to perform the turning over of a wafer-loading unit which carries the wafer.

9. The imaging system according to- claim 1 , wherein the image-plane-facing surface of the last optical element on the image-plane side is surrounded along its perimeter by a catch basin for the immersion fluid.

10. The imaging system according to claim 1 , wherein the object plane and the image plane are arranged parallel to each other.

11. The imaging system according to claim 1 , wherein the object plane and the image plane are perpendicular to each other.

12. The imaging system according to claim 1 , wherein the projection objective is a catadioptric objective with at least two concave mirrors, which produces at least two intermediate images.

13. The imaging system according to claim 1 , wherein the immersion liquid has a higher refractive index than the last optical element on the image-plane side.

14. The imaging system according to claim 1 , wherein the projection objective has a numerical aperture larger than 0.8.

15. The imaging system according to claim 1 , wherein the projection objective is designed for a wavelength of 248 nm, preferably for 193 nm, and with even higher preference for 157 nm.

16. A projection exposure apparatus, comprising:

an imaging system,

wherein the projection exposure apparatus is a microlithographic projection exposure apparatus for the manufacture of microstructured components, and the imaging system comprises:

a projection objective that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane; and

a liquid-delivery device serving to fill immersion liquid into an interstitial space between the image plane and a last optical element on the image-plane side of the projection objective;

wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane;

wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane; and

wherein the imaging system is configured to be used in a microlithographic projection exposure apparatus, the image-plane-facing surface of the last optical element is shaped on the image-plane side at least substantially like a spherical shell, and the curvature radius of the image-plane-facing surface of the last optical element on the image-plane side is between 0.9 and 1.5 times as large as the axial distance between the last optical element on the image-plane side and the image plane.

17. A method, comprising:

preparing a substrate which is at least partially covered with a coating of a light-sensitive material;

preparing a mask which carries structures of which an image is to be produced;

preparing a projection exposure apparatus with an imaging system;

projecting at least a part of the mask onto an area of said coating via the projection exposure apparatus while the coating is positioned above the last optical element of the projection objective as seen in the direction towards the coating, to manufacture microstructured components,

wherein the imaging system comprises:

a projection objective that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane; and

a liquid-delivery device serving to fill immersion liquid into an interstitial space between the image plane and a last optical element on the image-plane side of the projection objective;

wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane;

wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane; and

wherein the imaging system is configured to be used in a microlithographic projection exposure apparatus, the image-plane-facing surface of the last optical element is shaped on the image-plane side at least substantially like a spherical shell, and the curvature radius of the image-plane-facing surface of the last optical element on the image-plane side is between 0.9 and 1.5 times as large as the axial distance between the last optical element on the image-plane side and the image plane.

18. An imaging system comprising:

a projection objective that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane; and

a liquid-delivery device serving to fill immersion liquid into an interstitial space between the image plane and a last optical element on the image-plane side of the projection objective;

wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane;

wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane; and

wherein the imaging system is configured to be used in a microlithographic projection exposure apparatus,

wherein a rotator is provided which serves to rotate a substrate carrying the light-sensitive coating between a transport orientation in which the light-sensitive coating lies on a substrate surface that faces against the direction of gravity and an exposure orientation in which the light-sensitive coating lies on a substrate surface that faces in the direction of gravity.

19. The imaging system according to claim 18 , wherein the rotator is designed to perform the turning over of individual wafers which can be taken out of and returned to a wafer-tracking device.

20. The imaging system according to claim 18 , wherein the rotator is designed to perform the turning over of a wafer-loading unit which carries the wafer.

21. The imaging system according to claim 18 , wherein the last optical element on the image-plane side has a concave-curved surface facing in the direction towards the image plane and bordering on the immersion liquid.

22. The imaging system according to claim 21 , wherein the concave-curved surface of the last optical element on the image-plane side extends over an area that substantially fills out the entire contour dimensions of the last optical element as measured parallel to the image plane.

23. The imaging system according to claim 18 , wherein the projection objective is a catadioptric objective with at least two concave mirrors, which produces at least two intermediate images.

24. An imaging system comprising:

a projection objective that serves to project an image of a mask which can be set into position in an object plane onto a light-sensitive coating layer which can be set into position in an image plane; and

a liquid-delivery device serving to fill immersion liquid into an interstitial space between the image plane and a last optical element on the image-plane side of the projection objective;

wherein the last optical element on the image-plane side of the projection objective is arranged so that, seen in the direction of gravity, it follows the image plane;

wherein the projection objective is configured in such a way that when the system is operating with immersion, the immersion liquid has at least in some areas a convex-curved surface facing in the direction away from the image plane; and

wherein the imaging system is configured to be used in a microlithographic projection exposure apparatus,

wherein the projection objective is a catadioptric objective with at least two concave mirrors, which produces at least two intermediate images.

25. The imaging system according to claim 24 , wherein the last optical element on the image-plane side has a concave-curved surface facing in the direction towards the image plane and bordering on the immersion liquid.

26. The imaging system according to claim 25 , wherein the concave-curved surface of the last optical element on the image-plane side extends over an area that substantially fills out the entire contour dimensions of the last optical element as measured parallel to the image plane.

27. The imaging system according to claim 24 , wherein a substrate holder is provided which can be selectively actuated to apply a holding force for holding a substrate carrying the light-sensitive coating in an exposure position above the last optical element on the image-plane side.