Barrier stack with improved barrier properties
View Patent ↗An improved barrier stack for inhibiting diffusion of atoms or molecules, such as O 2 is disclosed. The barrier stack is particularly useful in capacitor over plug structures to prevent plug oxidation which can adversely impact the reliability of the structures. The barrier stack includes first and second barrier layers. In one embodiment, the first barrier layer comprises first and second sub-barrier layers having mismatched grain boundaries. The sub-barrier layers are selected from, for example, Ir, Ru, Pd, Rh, or alloys thereof. By providing mismatched grain boundaries, the interface of the sub-barrier layers block the diffusion path of oxygen. To further enhance the barrier properties, the first barrier layer is passivated with O 2 using, for example, a rapid thermal oxidation. The RTO forms a thin oxide layer on the surface of the first barrier layer. The oxide layer can advantageously promote mismatching of the grain boundaries of the first and second sub-barrier layer. The second barrier layer comprises a conductive oxide.
1. A barrier stack comprising:
a first sub-barrier layer, the first sub-barrier layer comprises a first sub-barrier conductive barrier material, the first sub-barrier layer includes grain boundaries;
a second sub-barrier layer disposed above the first sub-barrier layer, the second sub-barrier layer comprises a second sub-barrier conductive barrier material, the second sub-barrier layer includes grain boundaries; and
passivating elements are provided to passivate grain boundaries on an upper surface of the first sub-barrier layer.
2. The barrier stack of claim 1 serves as a barrier for capacitor over plug structure of a memory cell.
3. The barrier stack of claim 2 wherein the capacitor over plug structure includes a plug having a step over an ILD layer.
4. The barrier stack of claim 1 serves as a barrier for capacitor over plug structure of a plurality of memory cells arranged in a series architecture.
5. The barrier stack of claim 4 wherein the capacitor over plug structure includes a plug having a step over an ILD layer.
6. The barrier stack of claim 1 serves as a barrier for capacitor over plug structure of a ferroelectric memory cell.
7. The barrier stack of claim 6 wherein the capacitor over plug structure includes a plug having a step over an ILD layer.
8. The barrier stack of claim 1 serves as a barrier for capacitor over plug structure of a plurality of ferroelectric memory cells arranged in a series architecture.
9. The barrier stack of claim 8 wherein the capacitor over plug structure includes a plug having a step over an ILD layer.
10. The barrier stack of claim 1 wherein the passivating elements comprises oxygen.
11. The barrier stack of claim 10 wherein:
the first sub-barrier material comprises Ir, Ru, Rh, Pd, Hf or a combination thereof; and
the second sub-barrier material comprises Ir, Ru, Rb, Pd, Hf a conductive oxide or a combination thereof.
12. The barrier stack of claim 11 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
13. The barrier stack of claim 11 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
14. The barrier stack of claim 1 wherein:
the first sub-barrier material comprises Ir, Ru, Rh, Pd, Hf or a combination thereof; and
the second sub-barrier material comprises Ir, Ru, Rh, Pd, Hf a conductive oxide or a combination thereof.
15. The barrier stack of claim 14 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
16. The barrier stack of claim 1 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
17. The barrier stack of claim 14 wherein the passivating elements comprises a size greater than the grain boundaries of the first sub-barrier layer.
18. The barrier stack of claim 17 wherein:
the first sub-barrier material comprises Ir, Ru, Rh, Pd, Hf or a combination thereof; and
the second sub-barrier material comprises Ir, Ru, Rh, Pd, Hf, a conductive oxide or a combination thereof.
19. The barrier stack of claim 18 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
20. The barrier stack of claim 17 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
21. The barrier stack of claim 1 further comprises an upper barrier layer disposed above the second sub-barrier layer, the upper barrier layer comprises a conductive oxide.
22. The barrier stack of claim 21 wherein the passivating elements comprises a size greater than the grain boundaries of the first sub-barrier layer.
23. The barrier stack of claim 21 wherein the passivating elements comprises oxygen.
24. The barrier stack of claim 21 wherein:
the first sub-barrier material comprises Ir, Ru, Rh, Pd, Hf or a combination thereof; and
the second sub-barrier material comprises Ir, Ru, Rh, Pd, Hf, a conductive oxide or a combination thereof.
25. The barrier stack of claim 21 wherein the grain boundaries of the first and second sub-barrier layers are mismatched.
26. The barrier stack of claim 21 wherein the grain boundaries of the upper barrier and second sub-barrier layers are mismatched.
27. A barrier stack comprising:
a first sub-barrier layer, the first sub-barrier layer comprises a first sub-barrier conductive barrier material, the first sub-barrier layer includes grain boundaries;
a second sub-barrier layer disposed above the first sub-barrier layer, the second sub-barrier layer comprises a second sub-barrier conductive barrier material, the second sub-barrier layer includes grain boundaries; and
passivating elements are provided to passivate grain boundaries on an upper surface of the first sub-barrier layer, wherein the passivating elements comprises a size greater than the grain boundaries of the first sub-barrier layer.
28. A barrier stack comprising:
a first sub-barrier layer, the first sub-barrier layer comprises a first sub-barrier conductive barrier material, the first sub-barrier layer includes grain boundaries;
a second sub-barrier layer disposed above the first sub-barrier layer, the second sub-barrier layer comprises a second sub-barrier conductive barrier material, the second sub-barrier layer includes grain boundaries;
wherein grain boundaries of the first and second sub-barrier layers are mismatched; and
passivating elements are provided to passivate grain boundaries on an upper surface of the first sub-barrier layer.