Methods for dynamically controlling a semiconductor dicing saw

1. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer based on detection of a saw blade of the dicing saw contacting the semiconductor wafer;

wherein dynamically adjusting comprises:

terminating a current saw cut of the semiconductor dicing saw based upon detection that the saw blade no longer contacts the semiconductor wafer; and

proceeding to a subsequent saw cut upon termination of the current saw cut; and

wherein terminating a current saw cut comprises:

detecting that the saw blade no longer contacts the semiconductor wafer;

waiting a predefined time and/or distance of travel of the saw blade after it is detected that the saw blade no longer contacts the semiconductor wafer; and

terminating the current saw cut if after the predefined time and/or distance the saw blade still no longer contacts the semiconductor wafer.

2. The method of claim 1 , wherein proceeding to a subsequent saw cut further comprises beginning the subsequent saw cut at a start position based upon detection of when the saw blade is in contact with the semiconductor wafer during the current saw cut.

3. The method of claim 1 , further comprising mapping a shape of at least a portion of the semiconductor wafer based on the dynamically adjusted saw cut pattern.

4. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer based on detection of a saw blade of the dicing saw contacting the semiconductor wafer;

wherein dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on detection of a saw blade of the dicing saw contacting the semiconductor wafer comprises:

detecting a level of strain of the saw during a saw cut; and

dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on the detected level of strain indicating when the saw blade is contacting the semiconductor wafer; and

wherein detecting a level of strain comprises detecting strain associated with a drive shaft of the saw and/or sensing current provided to a drive motor of the saw.

5. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer based on detection of a saw blade of the dicing saw contacting the semiconductor wafer;

wherein dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on detection of a saw blade of the dicing saw contacting the semiconductor wafer comprises:

detecting a level of strain of the saw during a saw cut; and

dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on the detected level of strain indicating when the saw blade is contacting the semiconductor wafer; and

wherein dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on the detected level of strain indicating when the saw blade is contacting the semiconductor wafer comprises dynamically adjusting a saw cut pattern of the semiconductor dicing saw if the detected level of strain falls below a predefined strain threshold.

6. The method of claim 5 , wherein the predefined strain threshold is based on cut depth, wafer thickness, blade wear and/or blade rotational speed.

7. The method of claim 5 , wherein the wafer comprises a SiC wafer.

8. The method of claims 5 , wherein at least one saw cut of the saw cut pattern does not extend completely through a thickness of the semiconductor wafer.

9. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer; and

mapping a shape of at least a portion of the semiconductor wafer based on the dynamically adjusted saw cut pattern;

wherein mapping a shape comprises mapping a shape of the at least a portion of the semiconductor wafer based on detecting when the saw blade is contacting the at least a portion of the semiconductor wafer.

10. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer; and

mapping a shape of at least a portion of the semiconductor wafer based on the dynamically adjusted saw cut pattern;

wherein mapping a shape is carried out based on a first cutting pass of the at least a portion of the semiconductor wafer.

11. The method of claim 10 , further comprising establishing a path of the saw blade for a second cutting pass of the semiconductor wafer based on the mapped shape of the at least a portion of the semiconductor wafer.

12. A method of controlling a semiconductor dicing saw, comprising:

dynamically adjusting a saw cut pattern of the semiconductor dicing saw during a sawing operation of at least a portion of a semiconductor wafer based on detection of a saw blade of the dicing saw contacting the semiconductor wafer; and

providing a minimum saw cut length for each saw cut irrespective of detection of the saw blade of the dicing saw contacting the semiconductor wafer.

13. The method of claim 12 , wherein dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on detection of a saw blade of the dicing saw contacting the semiconductor wafer comprises:

detecting a level of strain of the saw during a saw cut; and

dynamically adjusting a saw cut pattern of the semiconductor dicing saw based on the detected level of strain indicating when the saw blade is contacting the semiconductor wafer.