Thermal interface structure with integrated liquid cooling and methods
View Patent ↗A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.
1. An integrated circuit chip assembly, comprising:
an integrated circuit chip;
a heat spreader;
a thermal interface structure, including a perimeter seal portion, the seal portion coupled between the heat spreader and at least a portion of a surface of the integrated circuit chip; and
wherein at least one interface of the perimeter seal portion includes cold formed features.
2. The integrated circuit chip assembly of claim 1 , wherein the thermal interface structure further includes a liquid material located within the perimeter seal portion and between the integrated circuit chip and the heat spreader.
3. The integrated circuit chip assembly of claim 2 , wherein the liquid material is in direct contact with both the integrated circuit chip and the heat spreader.
4. The integrated circuit chip assembly of claim 2 , wherein the liquid material includes liquid gallium metal.
5. The integrated circuit chip assembly of claim 1 , further including a number of guide portions within the perimeter seal portion.
6. The integrated circuit chip assembly of claim 5 , wherein the guide portions form longitudinal spaces having widths of approximately 0.0025–0.0050 cm.
7. The integrated circuit chip assembly of claim 1 , wherein the perimeter seal portion is formed from indium.
8. The integrated circuit chip assembly of claim 1 , wherein at least one interface of the perimeter seal portion further includes an intermetallic compound formed from a first and second mating material at the interface.
9. The integrated circuit chip assembly of claim 1 , wherein the thermal interface structure has a thickness of approximately 0.0025–0.0050 cm.