Low-loss printed circuit board antenna structure and method of manufacture thereof
View Patent ↗The present invention provides a method of manufacturing an antenna structure. In one embodiment, the method includes forming an antenna trace on a substrate proximate a ground plane of the substrate. In addition, the method includes creating an insulation region extending through the substrate and located between the antenna trace and the ground plane.
1. An antenna structure, comprising:
a substrate having a footprint;
an antenna trace having a perimeter formed on a face of said substrate proximate a ground plane of said substrate and said perimeter being substantially co-planar with said face, wherein said substrate has a predetermined radio frequency loss associated therewith; and
a low-loss region extending through said substrate, wherein said low-loss region is an opening located within said footprint that extends transverse to and intersects a plane of said face, and said low-loss region located between said antenna trace and said ground plane, wherein said low-loss region has a radio frequency loss less than said radio frequency loss associated with said substrate, and wherein said low-loss region is located outside of said perimeter of said antenna trace.
2. The antenna structure recited in claim 1 further including a plurality of said low-loss regions.
3. The antenna structure recited in claim 2 wherein each of said low-loss regions is separated by a portion of said substrate.
4. The antenna structure recited in claim 1 wherein said low-loss region is selected from a group consisting of:
ABS plastic;
air;
ceramic; and
Teflon.
5. The antenna structure recited in claim 1 wherein said antenna trace includes antenna traces located on opposing surfaces of said substrate and connected by a via.
6. The antenna structure recited in claim 1 wherein said substrate is comprised of a high loss material.
7. A method of manufacturing an antenna structure, comprising:
forming an antenna trace having a perimeter formed on a face of a substrate having a footprint proximate a ground plane of said substrate and said perimeter being substantially co-planar with said face, wherein said substrate has a predetermined radio frequency loss associated therewith; and
creating a low-loss region extending through said substrate and located between said antenna trace and said ground plane, wherein said low-loss region is an opening located within said footprint that extends transverse to and intersects a plane of said face, and wherein said low-loss region has a radio frequency loss less than said radio frequency loss associated with said substrate, and wherein said low-loss region is located outside said perimeter of said antenna trace.
8. The method recited in claim 7 wherein said creating includes creating a plurality of low-loss regions.
9. The method recited in claim 7 wherein said creating includes creating a plurality of low-loss regions separated by a portion of said substrate.
10. The method recited in claim 7 wherein said substrate is comprised of a high-loss material.
11. The method recited in claim 7 wherein said creating includes creating a low-loss region selected from a group consisting of:
ABS plastic;
air;
ceramic; and
Teflon.
12. The method recited in claim 7 wherein said forming includes forming antenna traces located on opposing surfaces of said substrate interconnected by a via extending through said substrate.
13. A printed circuit board (PCB), comprising:
a substrate having a footprint and a ground plane and conductive traces formed thereon, wherein said substrate has a predetermined radio frequency loss associated therewith; and
an antenna structure, including:
an antenna trace having a perimeter formed on a face of a substrate proximate a ground plane of said substrate and said perimeter being substantially co-planar with said face, wherein said substrate has a predetermined radio frequency loss associated therewith; and
an low-loss region extending through said substrate and located between said antenna trace and said ground plane, wherein said low-loss region is an opening located within said footprint that extends transverse to and intersects said face, and wherein said low-loss region has a radio frequency loss less than said radio frequency loss associated with said substrate, and wherein said low-loss region is located outside said perimeter of said antenna trace.
14. The PCB recited in claim 13 wherein said substrate is comprised of a high-loss material.
15. The PCB recited in claim 13 wherein said low-loss region includes a plurality of low-loss regions separated by a portion of said substrate.
16. The PCB recited in claim 13 wherein said substrate has a footprint, and said low-loss region is an opening located within a said footprint of said substrate.
17. The PCB recited in claim 16 wherein said low-loss region includes a low-loss material selected from a group consisting of:
ABS plastic;
air;
ceramic; and
Teflon.
18. The PCB recited in claim 13 wherein said antenna trace includes antenna traces located on opposing surfaces of said substrate interconnected by a via extending through said substrate.
19. An antenna structure, comprising:
an antenna trace formed on a substrate proximate a ground plane of said substrate, wherein said substrate has a footprint and a predetermined radio frequency loss associated therewith; and
a low-loss region extending through said substrate and located between said antenna trace and said ground plane, wherein said low-loss region is an opening located within said footprint that extends transverse to and intersects a plane of said face, and wherein said low-loss region has a radio frequency loss less than said radio frequency loss associated with said substrate, and said antenna trace does not overlap said low-loss region.