Optoelectronic component and method for producing it
View Patent ↗An optoelectronic component having a basic housing or frame ( 12 ) and at least one semiconductor chip ( 20 ), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity ( 18 ) of the basic housing. In order to increase the efficiency of the optoelectronic component ( 10 ), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound ( 28 ) filled at least partly into the cavity ( 18 ) is provided, the material and the quantity of the filling compound ( 28 ) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas ( 30 ) of the filling compound serve as reflector.
1. Optoelectronic component ( 10 ) having at least one basic housing ( 12 ), which has a cavity ( 18 ), and at least one semiconductor chip ( 20 ), which is arranged in the cavity ( 18 ) and emits and/or receives electromagnetic radiation, the cavity ( 18 ) extending from a front side ( 121 ) of the basic housing ( 12 ) into the basic housing ( 12 ),
characterized in that
a reflective filling compound ( 28 ) is arranged in the cavity ( 18 ) between the semiconductor chip ( 20 ) and side walls ( 26 ) of the cavity, of which filling compound at least one of its surfaces ( 30 ) facing toward the front side ( 121 ) of the basic housing ( 12 ) is curved like a concave mirror, in particular concavely, as seen from the semiconductor chip ( 20 ), and forms a reflector area for part of the radiation.
2. Optoelectronic component according to claim 1 ,
characterized in that
a chip carrier substrate ( 24 ) is arranged between the semiconductor chip ( 20 ) and the basic housing ( 12 ), the dimensions of which chip carrier substrate are chosen in such a way that a trench is formed between its side edges ( 241 ) and the side walls ( 26 ) of the cavity ( 18 ), the filling compound ( 28 ) being situated in the said trench.
3. Optoelectronic component according to claim 1
characterized in that,
relative to a bottom area of the cavity ( 18 ), the filling height (h F ) of the filling compound ( 28 ) adjacent to the semiconductor chip ( 20 ) is less than the distance between the region of the relevant laterally emitting and/or receiving region of the semiconductor chip ( 20 ) and the bottom area and the filling height (h F ) rises beyond this distance in its course towards the side wall of the cavity.
4. Optoelectronic component according to claim 1 ,
characterized in that
the filling compound ( 28 ) contains particles made of a material having a higher refractive index than the rest of the material of the filling compound.
5. Optoelectronic component according to claim 4 ,
characterized in that
the filling compound ( 28 ) has epoxy resin and the particles have a higher refractive index than the expoxy resin.
6. Optoelectronic component according to claim 4 ,
characterized in that
the particles contain TiO 2 zirconium dioxide, zinc oxide, barium sulphate, gallium nitride particles and/or a combination of such particles.
7. Optoelectronic component according to claim 4
characterized in that
the proportion by volume of particles in the filling compound ( 28 ) is chosen to be such that it leads to an increase in the reflectivity of the filling compound ( 28 ).
8. Optoelectronic component according to claim 6 ,
characterized in that
the proportion by volume of TiO 2 particles in the filling compound ( 28 ) is between about 10 and 50% by volume.
9. Optoelectronic component according to claim 1 ,
characterized in that
the semiconductor chip ( 20 ) is at least partly encapsulated with a radiation-transmissive encapsulation compound ( 2 ).
10. Optoelectronic component according to claim 1 ,
characterized in that the basic housing ( 12 ) has a
carrier body ( 16 ), on which there are arranged a housing frame ( 120 ), which forms the cavity ( 18 ), and at least one external electrical connection ( 14 ), reaching into the cavity ( 18 ), for the semiconductor chip ( 20 ).
11. Optoelectronic component according to claim 10 ,
characterized in that
a chip carrier substrate ( 24 ) is arranged between the semiconductor chip ( 20 ) and the basic housing ( 12 ), the dimensions of which chip carrier substrate are chosen in such a way that a trench is formed between its side edges ( 241 ) and the side walls ( 26 ) of the cavity ( 18 ), the filling compound ( 28 ) being situated in the said trench, and
characterized in that the carrier body ( 16 ) and the chip carrier substrate ( 24 ) are produced from materials having good thermal conductivity.
12. Optoelectronic component according to claim 11
characterized in that
the carrier body ( 16 ) essentially has metallic material.
13. Optoelectronic component according to claim 11 ,
characterized in that
the chip carrier substrate ( 24 ) essentially has silicon.