IP Library Granted Patent US 7,093,066
Granted Patent B2
US 7,093,066 · App. 10/615,326 · Granted Aug 15, 2006

Method for bus capacitance reduction

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Quick Facts
Patent No.
US 7,093,066
App. No.
10/615,326
Granted
Aug 15, 2006
Kind
B2
Abstract

Data bus capacitance is reduced by decoupling unaccessed memory circuits from a data bus during data transfers to or from other memory circuits.

Claims (42)

1. A method of making a memory module comprising:

attaching at least one memory integrated circuit to a printed circuit board, said printed circuit board comprising data bus contacts on a portion thereof;

coupling said data bus contacts on said printed circuit board to data bus terminals on said memory integrated circuit through a bus switch;

attaching a state decoder to the printed circuit board, the printed circuit board further comprising control bus contacts on a portion thereof;

coupling the control bus contacts on the printed circuit board to control bus terminals on the state decoder; and

interfacing the state decoder with a host system comprising a memory controller, the memory controller producing control signals, wherein the control signals comprise at least one of a row address strobe (RAS), a column address strobe (CAS), and a write enable (WE);

wherein said state decoder decodes the control signals to determine whether the memory integrated circuit is being accessed and produces a gate control signal to selectively control said bus switch;

wherein, in response to the gate control signal, the bus switch decouples the data bus from the memory integrated circuit when the memory integrated circuit is not being accessed to reduce data bus capacitance; and

wherein the interfacing does not provide the gate control signal to the bus switch.

2. The method of claim 1 , wherein the memory integrated circuit comprises synchronous DRAM.

3. The method of claim 1 , further comprising interfacing the state decoder with the bus switch.

4. The method of claim 1 , wherein the state decoder is structured to decode at least one control gate and control the bus switch in response thereto.

5. The method of claim 1 wherein the bus switch electrically removes a portion of the data bus associated with unaccessed memory circuits.

6. The method of claim 5 wherein capacitance of unaccessed memory circuits is associated with the portion of the data bus.

7. The method of claim 1 wherein the memory integrated circuit comprises the bus switch.

8. The method of claim 1 wherein the memory integrated circuit comprises the state decoder.

9. A method of making a memory module comprising:

attaching at least one memory integrated circuit to a printed circuit board, said printed circuit board comprising data bus contacts on a portion thereof; and

coupling said data bus contacts on said printed circuit board to data bus terminals on said memory integrated circuit;

positioning a bus switch in a data path to the memory integrated circuit; and

interfacing a state decoder with a memory controller, the memory controller producing control signals, wherein the control signals comprise at least one of a row address strobe (RAS), a column address strobe (CAS), and a write enable (WE);

wherein said state decoder decodes the control signals to determine whether the memory integrated circuit is being accessed and produces a gate control signal to selectively control said bus switch;

wherein, in response to the gate control signal, the bus switch decouples the data bus from the memory integrated circuit when the memory integrated circuit is not being accessed to reduce data bus capacitance; and

wherein the interfacing does not provide the gate control signal to the bus switch.

10. The method of claim 9 , wherein the memory integrated circuit comprises synchronous DRAM.

11. The method of claim 9 , further comprising interfacing the state decoder with the bus switch.

12. The method of claim 9 , wherein the state decoder is structured to decode at least one control gate and control the bus switch in response thereto.

13. The method of claim 9 , wherein the memory integrated circuit comprises the bus switch.

14. The method of claim 9 , wherein the bus switch is positioned externally with respect to the memory integrated circuit.

15. The method of claim 9 wherein the memory integrated circuit comprises the state decoder.

16. A method of making a memory integrated circuit comprising the acts of:

connecting data input terminals to an input portion of a bus switch;

connecting an output portion of said bus switch to a data input buffer;

coupling an output of said data input buffer to a memory storage circuit; and

connecting a state decoder to a memory controller, the memory controller producing control signals;

wherein said state decoder decodes the control signals to determine whether the memory integrated circuit is being accessed and produces a gate control signal to selectively control said bus switch;

wherein, in response to the gate control signal, the bus switch decouples the data bus from the data input buffer when the memory storage circuit is not being accessed to reduce data bus capacitance; and

wherein the memory controller does not provide the gate control signal to the bus switch.

17. The method of claim 16 wherein the state decoder is located within the memory integrated circuit.

18. The method of claim 16 wherein the bus switch is located within the memory integrated circuit.

19. The method of claim 16 , further comprising interfacing the state decoder with the bus switch.

20. The method of claim 16 , wherein the state decoder is structured to decode at least one control gate and control the bus switch in response thereto.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →