Fabrication of dielectric for a nonvolatile memory cell having multiple floating gates
View Patent ↗A memory cell ( 110 ) has a select gate ( 140 ) and at least two floating gates ( 160 ). A gate dielectric ( 150 ) for the floating gates ( 160 ) is formed by thermal oxidation simultaneously with as a dielectric on a surface of the select gate ( 140 ). The dielectric thickness on the select gate is controlled by the dopant concentration in the select gate. Other features are also provided.
1. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, each first surface portion being defined as an entire surface portion lying under the respective floating gate, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein at least a portion of the first dielectric and at least a portion of the second dielectric are formed simultaneously; and
(3) forming the floating gates on the second dielectric;
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit;
wherein the first gate is a select gate;
the method further comprising forming two control gates for the memory cell, the control gates being insulated from the select gate by the first dielectric;
wherein the floating gates are adjacent to respective first portions of the first gate and the control gates are adjacent to respective second portions of the first gate, the second portions having positive lengths in a vertical cross section.
2. The method of claim 1 further comprising, before forming the control gates, forming a third dielectric over the floating and select gates, the third dielectric insulating the control gates from the first gate together with the first dielectric.
3. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein the first dielectric and at least a portion of the second dielectric are formed by simultaneous oxidation of the first gate surface and of the first surface portions; and
(3) forming the floating gates on the second dielectric;
wherein the first surface portions comprise the top surface's entire region underlying both the floating gates and the second dielectric formed in the operation (2);
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit.
4. The method of claim 3 wherein the first dielectric and at least a portion of the second dielectric are formed by the simultaneous oxidation but are different in thickness.
5. The method of claim 4 wherein the first gate surface comprises doped semiconductor material, and the oxidation rate of the first gate surface depends on the dopant concentration in the doped semiconductor material.
6. The method of claim 3 wherein all of the first dielectric and all of the second dielectric are formed by simultaneous oxidation of the first gate surface and the first surface portions but are different in thickness.
7. The method of claim 6 wherein the first gate surface is a semiconductor surface.
8. The method of claim 6 wherein the first gate surface is a silicon surface, and the semiconductor region is a silicon region.
9. The method of claim 3 wherein at least one of the floating gates or said element physically contact the first dielectric.
10. The method of claim 3 wherein the first dielectric insulates the first gate from the floating gates.
11. The method of claim 10 wherein each of the floating gates physically contacts the first dielectric.
12. The method of claim 10 wherein the second dielectric is a tunnel oxide and is the only dielectric separating the floating gates from the channel region.
13. The method of claim 12 wherein the first dielectric is about 300 Å thick, and the second dielectric is 60 Å to 100 Å thick.
14. The method of claim 3 wherein the first dielectric is about 300 Å thick, and the second dielectric is 60 Å to 100 Å thick.
15. The method of claim 3 wherein the top surface of the semiconductor region between each floating gate and the first conductive gate has the first conductivity type at the beginning of the operation (2).
16. The method of claim 3 wherein all of the first dielectric and all of the second dielectric are formed simultaneously, and the second dielectric is the only dielectric insulating the channel region from the floating gates.
17. The method of claim 16 wherein the first dielectric is the only dielectric insulating the first conductive gate from the floating gates.
18. The method of claim 3 further comprising forming at least one source/drain region of a second conductivity type opposite to the first conductivity type for the memory cell, the source/drain region being formed after the operation (2), the source/drain region extending into at least one of the first surface portions.
19. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein at least a portion of the first dielectric and at least a portion of the second dielectric are formed simultaneously but are different in thickness; and
(3) forming the floating gates on the second dielectric;
wherein the first surface portions comprise the top surface's entire region underlying both the floating gates and the second dielectric formed in the operation (2);
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit.
20. The method of claim 19 wherein all of the first dielectric and at least a portion of the second dielectric are formed simultaneously; and
the first dielectric is the only dielectric separating at least a portion of the first gate surface from at least a portion of at least one of the floating gates or said other element of the integrated circuit.
21. The method of claim 19 wherein the first dielectric and at least a portion of the second dielectric are formed by simultaneous oxidation of the first gate surface and of the first surface portions.
22. The method of claim 19 wherein the second dielectric is a tunnel oxide and is the only dielectric separating the floating gates from the channel region.
23. The method of claim 22 wherein the first dielectric is about 300 Å thick, and the second dielectric is 60 Å to 100 Å thick.
24. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein at least a portion of the first dielectric and at least a portion of the second dielectric are formed simultaneously; and
(3) forming the floating gates on the second dielectric;
wherein the first surface portions comprise the top surface's entire region underlying both the floating gates and the second dielectric formed in the operation (2);
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit;
wherein the first gate is a select gate.
25. The method of claim 24 wherein the channel region runs between two source/drain regions of the memory cell, and a portion of the channel region is controlled by the first gate.
26. The method of claim 24 wherein a state of the memory cell is alterable by transferring a charge between any one of the floating gates and the channel region through the second dielectric.
27. The method of claim 24 wherein the memory cell is part of an array of nonvolatile memory cells, each memory cell having a select gate, two floating gates, and a channel region which has a portion controlled by the select gate and two other portions controlled by the respective floating gates.
28. The method of claim 27 wherein each memory cell has two control gates which, together with the floating gates, control the channel region portions controlled by the floating gates.
29. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein at least a portion of the first dielectric and at least a portion of the second dielectric are formed simultaneously; and
(3) forming the floating gates on the second dielectric;
wherein the first surface portions comprise the top surface's entire region underlying both the floating gates and the second dielectric formed in the operation (2);
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit;
wherein the second dielectric is a tunnel oxide and is the only dielectric separating the floating gates from the channel region.
30. A method for fabricating an integrated circuit comprising a nonvolatile memory cell comprising a first conductive gate and two conductive floating gates, wherein the floating gates overlie a channel region of the memory cell, wherein the channel region is part of a semiconductor region having a top surface, and each floating gate overlies a respective first surface portion of the top surface of said semiconductor region, the method comprising:
(1) providing a first gate surface which is a surface of the first conductive gate;
(2) forming a first dielectric on the first gate surface and a second dielectric on the entire first surface portions, the entire first surface portions having a first conductivity type, wherein at least a portion of the first dielectric and at least a portion of the second dielectric are formed by simultaneous oxidation of the first gate surface and of the channel region but are different in thickness; and
(3) forming the floating gates on the second dielectric;
wherein the first surface portions comprise the top surface's entire region underlying both the floating gates and the second dielectric formed in the operation (2);
wherein the first dielectric is used to insulate the first gate from the floating gates and/or from another element of the integrated circuit.
31. The method of claim 30 wherein the first gate surface comprises doped semiconductor material whose oxidation rate depends on the dopant concentration in the doped semiconductor material.
32. The method of claim 30 wherein the first dielectric insulates the first gate from the floating gates.