IP Library › Granted Patent US 6,825,065
Granted Patent Utility
US 6,825,065 · Confirmation No. 4315

METHOD FOR OPTICAL MODULE PACKAGING OF FLIP CHIP BONDING

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2004-08-05 1449 List of References cited by applicant and considered by examiner 2 View
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2004-08-05 SPEC Specification 1 View
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2003-08-01 TRNA Transmittal of New Application 2 View
2003-08-01 SPEC Specification 13 View
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Quick Facts
Patent No.
US 6,825,065
App. No.
10/632,589
Filed
2003-08-01
Granted
2004-11-30
Pub. No.
US20040023437A1
Examiner
VU, DAVID
Art Unit
2818
PTA
0 days