IP Library Granted Patent US 7,625,460
Granted Patent B2
US 7,625,460 · App. 10/632,628 · Granted Dec 1, 2009

Multifrequency plasma reactor

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Quick Facts
Patent No.
US 7,625,460
App. No.
10/632,628
Granted
Dec 1, 2009
Kind
B2
Abstract

A multifrequency plasma reactor includes first, second and third power generators operably coupled to at least one of an upper and lower electrode for generating power signals. The plasma reactor further includes a controller for selectively activating the power generators according to an activation profile that results in the formation of a desirable narrow gap via in a semiconductor wafer. A method of generating a plasma in the reactor for etching the semiconductor wafer is also described by way of configuring the power generators according to various activation configurations during various phases of the etching process.

Claims (30)

1. A parallel plate plasma reactor, comprising:

first, second and third power generators wherein the first power generator is capacitively coupled to an upper

electrode and the second and third power generators are capacitively coupled to a lower electrode for supporting a wafer thereon, the first, second and third power generators being frequency-based power generators; and

a controller configured to individually selectively activate the first, second and third power generators to a plurality of activation configurations during a plurality of phases of a duty cycle of a process, wherein at least one of the plurality of activation configurations includes differently activating the second and third power generators to generate at least two different active states on the lower electrode;

wherein each of the second and third power generators are configured to independently receive a signal from the controller and independently apply energy directly to the lower electrode entirely to generate the at least two different active states thereon.

2. The plasma reactor of claim 1 , wherein the second power generator is configured to operate at a frequency of at least three times an operational frequency of the third power generator.

3. The plasma reactor of claim 1 , wherein the first power generator is configured to operate at a frequency of at least greater than or equal to each of an operational frequency of the second power generator and an operational frequency of the third power generator.

4. The plasma reactor of claim 1 , wherein the controller is operable to place the first power generator in an inactive mode and the second and third power generators in an active mode.

5. The plasma reactor of claim 1 , wherein the controller is operable to place the first and third power generators in an active mode and the second power generator in an inactive mode.

6. The plasma reactor of claim 1 , wherein the controller is operable to place the first and second power generators in an active mode and the third power generator in an inactive mode.

7. The plasma reactor of claim 1 , wherein the controller is operable to place the first, second and third power generators in an active mode.

8. The plasma reactor of claim 1 , wherein the controller during a process is operable to configure the first, second and third power generators to a first activation configuration during a first phase thereof and to reconfigure the first, second and third power generators to a second activation configuration during a second phase thereof.

9. The plasma reactor of claim 1 , wherein the controller is further operable to control power levels of the first, second and third power generators during the plurality of activation configurations.

10. The plasma reactor of claim 1 , wherein each of the first, second and third power generators is capacitively coupled to one of the upper and lower electrodes.

11. The plasma reactor of claim 1 , wherein the second power generator operates at a frequency of about 13.5 MHz to about 60 MHz.

12. The plasma reactor of claim 1 , wherein the first power generator operates at a frequency of about 40 MHz to about 100 MHz.

13. The plasma reactor of claim 1 , wherein the third power generator operates at a frequency of about 1 MHz to about 13.5 MHz.

14. A parallel plate plasma reactor, comprising:

a vacuum chamber including upper and lower electrodes therein;

first, second and third power generators wherein the first power generator is capacitively coupled to an upper electrode and the second and third power generators are capacitively coupled to a lower electrode for supporting a wafer thereon, the first, second and third power generators being frequency-based power generators; and

a controller configured to individually selectively activate the first, second and third power generators to a plurality of activation configurations during a plurality of phases of a duty cycle of a process, wherein at least one of the plurality of activation configurations includes differently activating the second and third power generators to generate at least two different active states on the lower electrode;

wherein each of the second and third power generators are configured to independently receive a

signal from the controller and independently apply energy directly to the lower electrode entirely to generate the at least two different active states thereon.

15. The plasma reactor of claim 14 , further comprising a wafer table, wherein the lower electrode is coupled to the wafer table and the upper electrode is arranged above the wafer table.

16. The plasma reactor of claim 14 , wherein each of the first, second and third power generators is capacitively coupled to one of the upper and lower electrodes.

17. The plasma reactor of claim 14 , wherein the first power generator is capacitively coupled to the upper electrode and the second and third power generators are capacitively coupled to the lower electrode.

18. The plasma reactor of claim 17 , wherein the second power generator is configured to operate at a frequency of at least three times a frequency of the third power generator.

19. The plasma reactor of claim 18 , wherein the second power generator is configured to operate at a frequency of about 13.5 MHz to about 60 MHz.

20. The plasma reactor of claim 18 , wherein the first power generator is configured to operate at a frequency of about 40 MHz to about 100 MHz.

21. The plasma reactor of claim 18 , wherein the third power generator is configured to operate at a frequency of about 1 MHz to about 13.5 MHz.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2003
From: HOWARD, BRADLEY J.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 014371/0951 →