IP Library Granted Patent US 6,995,080
Granted Patent B2
US 6,995,080 · App. 10/635,715 · Granted Feb 7, 2006

Methods of forming transistor gates

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Quick Facts
Patent No.
US 6,995,080
App. No.
10/635,715
Granted
Feb 7, 2006
Kind
B2
Abstract

The invention includes a method of forming a transistor gate. One or more conductive materials are formed over a semiconductor substrate, and a block is formed over the one or more conductive materials. The block comprises a photoresist mass and a material other than photoresist which is against the photoresist. A pattern is transferred from the block to the one or more conductive materials to pattern a transistor gate construction from the one or more conductive materials.

Claims (10)

1. A method of forming a transistor gate, comprising:

forming one or more conductive materials over a semiconductor substrate;

providing a photoresist block which is over a first portion of the one or more conductive materials and not over a second portion of the one or more conductive materials;

forming a layer over the photoresist block and over at least some of the second portion of the one or more conductive materials, the layer having a first segment that is against the photoresist block and a second segment that is not against the photoresist block;

treating the layer so that the first segment becomes different than the second segment;

after the treating, selectively removing the second segment of the layer while leaving the first segment of the layer; the photoresist block and remaining first segment together defining a masking block that is laterally wider than the photoresist block; and

transferring a pattern from the masking block to the one or more conductive materials to pattern a transistor gate construction from the one or more conductive materials.

2. The method of claim 1 further comprising removing the masking block from over the transistor gate construction.

3. The method of claim 1 further comprising defining a channel region within the semiconductor substrate beneath the transistor gate construction; and forming source/drain regions within the semiconductor substrate and spaced from one another by the channel region.

4. The method of claim 1 wherein the treatment includes causing the photoresist to release an acid which forms cross-links within the first segment of the layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 4, 2010
From: MICRON TECHNOLOGY, INC.
To: ROUND ROCK RESEARCH, LLC
Reel/Frame 023786/0416 →