SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING MEMORY CELL SECTION HAVING CAPACITOR OVER BITLINE STRUCTURE AND WITH THE MEMORY AND PERIPHERAL SECTIONS HAVING CONTACT PLUG STRUCTURES CONTAINING A BARRIER FILM AND EFFECTING ELECTRICAL CONTACT WITH MISFETS OF BOTH MEMORY AND PERIPHERAL SECTIONS
View Patent ↗The sheet resistance of a gate electrode 8 A (a word line) of memory cell selection MISFET Q a DRAM and a sheet resistance of bit lines BL 1 , BL 2 are, respectively, 2 Ω/□ or below. Interconnections of a peripheral circuit are formed during the step of forming the gate electrode 8 A (the word line WL) or the bit lines BL 1 , BL 2 by which the number of the steps of manufacturing the DRAM can be reduced.
1. A semiconductor integrated circuit device comprising:
first MISFETs formed in a first region, each of said first MISFETs at least having a source region and a drain region;
second MISFETs formed in a second region, each of said second MISFETs at least having a source region and a drain region;
at least one bit line formed over said first region;
at least one word line formed in said first region;
at least one capacitor element formed over one of said bit lines,
wherein each of said first MISFETs is included in an individual one of plural memory cells, each of said memory cells being coupled to a respective word line, a respective bit line and said capacitor element corresponding thereto;
a first insulating film interposed between said first and second MISFETs and said at least one bit line;
a second insulating film formed over said first insulating film, said second insulating film being interposed between said at least one bit line and said at least one capacitor element; and
a wiring layer formed over said second insulating film,
wherein each of said at least one bit line is connected to one of said source and drain regions of ones of said first MISFETs corresponding thereto via one of first plugs formed in said first insulating film,
wherein each of said at least one capacitor element is connected to the other of said source and drain regions of ones of said first MISFETs corresponding thereto via a corresponding second plug formed in said second insulating film and another of said first plugs,
wherein said wiring layer is connected to said source and drain regions of ones of said second MISFETs via respective ones of third plugs formed in said first and second insulating film, and
wherein said second plug is formed of a built-up film.
2. A semiconductor integrated circuit device according to claim 1 , wherein said built-up film is formed of a titanium nitride film and a tungsten film.
3. A semiconductor integrated circuit device comprising:
first MISFETs formed in a first region, each of said first MISFETs at least having a source region and a drain region;
second MISFETs formed in a second region, each of said second MISFETs at least having a source region and a drain region;
at least one bit line formed over said first region;
at least one word line formed in said first region;
at least one capacitor element formed over one of said bit lines,
wherein each of said first MISFETs is included in an individual one of plural memory cells, each of said memory cells being coupled to a respective word line, a respective bit line and said capacitor element corresponding thereto;
a first insulating film interposed between said first and second MISFETs and said at least one bit line;
a second insulating film formed over said first insulating film, said second insulating film being interposed between said at least one bit line and said at least one capacitor element; and
a wiring layer formed over said second insulating film,
wherein each of said at least one bit line is connected to one of said source and drain regions of ones of said first MISFETs corresponding thereto via one of first plugs formed in said first insulating film,
wherein each of said at least one capacitor element is connected to the other of said source and drain regions of ones of said first MISFETs corresponding thereto via a corresponding second plug formed in said second insulating film and another of said first plugs,
wherein said wiring layer is connected to said source and drain regions of ones of said second MISFETs via respective ones of third plugs formed in said first and second insulating film, and
wherein said third plugs are formed of a built-up film.
4. A semiconductor integrated circuit device according to claim 3 , wherein said built-up film is formed of a titanium nitride film and a tungsten film.