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App. No. 10/647,040 · Confirmation No. 1660

FILM DEPOSITION TO ENHANCE SEALING YIELD OF MICROCAP WAFER-LEVEL PACKAGE WITH VIAS

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2006-05-30 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-07-07 IFEE Issue Fee Payment (PTO-85B) 1 View
2004-04-08 NOA Notice of Allowance and Fees Due (PTOL-85) 8 View
2004-04-08 1449 List of References cited by applicant and considered by examiner 2 View
2004-04-08 892 List of references cited by examiner 1 View
2004-04-08 IIFW Issue Information including classification, examiner, name, claim, renumbering, etc. 1 View
2004-04-08 SRFW Search information including classification, databases and other search related notes 1 View
2004-04-08 FWCLM Index of Claims 1 View
2004-04-01 SRNT Examiner's search strategy and results 3 View
2004-03-31 FWCLM Index of Claims 1 View
2004-03-30 SRNT Examiner's search strategy and results 8 View
2003-12-04 OATH Oath or Declaration filed 4 View
2003-11-17 PEFN Pre-Exam Formalities Notice 2 View
2003-08-21 TRNA Transmittal of New Application 1 View
2003-08-21 SPEC Specification 4 View
2003-08-21 CLM Claims 2 View
2003-08-21 ABST Abstract 1 View
2003-08-21 DRW Drawings-only black and white line drawings 5 View
2003-08-21 OATH Oath or Declaration filed 5 View
2003-08-21 IDS Information Disclosure Statement (IDS) Form (SB08) 2 View
2003-08-21 WFEE Fee Worksheet (SB06) 1 View
2003-08-21 WFEE Fee Worksheet (SB06) 1 View
2003-08-21 WFEE Fee Worksheet (SB06) 1 View
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Quick Facts
App. No.
10/647,040
Filed
2003-08-21
Granted
2004-08-17
Art Unit
2825
PTA
0 days