Patent Assignment
Reel/Frame 014168/0508
Assignment of Assignor's Interest
Recorded: 2003-12-02
Pages: 5
Assignors
GAN, QING
Executed: 2003-08-19
RUBY, RICHARD C.
Executed: 2003-08-20
GEEFAY, FRANK S.
Executed: 2003-08-26
BARFKNECKT, ANDREW T.
Executed: 2003-08-19
Assignee
AGILENT TECHNOLOGIES, INC.
P.O. BOX 7599, LEGAL DEPARTMENT, DL429, LOVELAND, COLORADO, 80537-0599
Covered Property
(1)
Film Deposition to Enhance Sealing Yield of Microcap Wafer-Level Package with Vias
Patent:
6,777,263 →
Application:
10/647,040 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017207/0020 →
Security Agreement
Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
Assignment of Assignor's Interest
May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD
To: AVAGO TECHNOLOGIES WIRELESS IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0434 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 017207 Frame 0020. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →