Carrier-based electronic module
An improved multi-chip module includes a circuit board having an array of electrical interconnection pads to which are mounted a plurality of IC package units. Each IC package unit includes multiple IC packages, which are mounted on opposite sides of a package carrier. The package units may be mounted on one or both sides of the circuit board. A variety of package carriers are used to create a number of different modules. One type of package carrier has a pair of major planar surfaces. Each planar surface incorporates electrical contact pads. At least one IC package is surface mounted on each major planar surface, by interconnecting the connection elements, or leads, of the package with the contact pads on the planar surface, to form the IC package unit. Another type of package carrier substrate has a multiple recesses for back-to-back surface mounting of the IC packages. The package also includes in various versions heat sinks.
1. An electronic circuit module comprising:
a carrier, comprising a first integrated circuit mounting location comprising at least one first mounting pad array, and a second integrated circuit mounting location disposed on the opposite side of said first mounting pad array comprising at least one second mounting pad array wherein said first and second mounting pad arrays are conductively coupled with said carrier;
first and second sets of integrated circuit packages, each set comprising at least one package, and each package having a package body comprising at least one integrated circuit chip and a ball-grid array; wherein said ball-grid array of said at least one first integrated circuit package is directly above said first mounting pad array and said ball-grid array of said second integrated circuit package is directly beneath said second mounting pad array, and wherein said ball-grid array of said first and second sets of integrated circuit packages are conductively bonded to said first and second mounting pad arrays; and
a printed circuit board having at least one interconnection pad array coupled to circuitry on said printed circuit and conductively bonded to said carrier, said carrier further comprises a carrier body with a recess for receiving at least a portion of said second set of integrated circuit packages.
2. The electronic circuit module of claim 1 wherein individual mounting pads of said at least one first mounting pad array are coupled to individual mounting pads of said at least one second mounting pad array by means of conductive links within said carrier.
3. The electronic circuit module of claim 1 further comprising a flexible polymeric film comprising first and second major planar faces corresponding, respectively, to said first and second integrated circuit mounting locations.
4. The electronic circuit module of claim 1 wherein said carrier further comprises a semi-rigid laminar substrate having first and second major faces corresponding, respectively, to said first and second integrated circuit mounting locations.
5. The electronic circuit module of claim 1 wherein individual mounting pads of said at lease one first mounting pad array and said at least one second mounting pad array are conductively coupled to individual balls of said ball-grid array on said carrier, and wherein said ball-grid array is conductively coupled to said interconnection pad array.
6. The electronic circuit module of claim 3 wherein said first major face is planar, and said second major face comprise a recess, said first sets of integrated circuit packages are mounted on said planar first major face and said second sets of integrated circuit packages are mounted within said recess.
7. The electronic circuit module of claim 1 wherein said ball-grid array on said carrier comprises balls configured in at least single row.
8. The electronic circuit module of claim 1 wherein said ball-grid array on said carrier comprises balls configured in a double row.
9. The electronic circuit module of claim 1 wherein said ball-grid array is selected from the group of Polyimide ball-grid array and ceramic ball-grid array.
10. An electronic circuit module comprising:
a carrier, comprising a first integrated circuit mounting location comprising at least one first mounting pad array, and a second integrated circuit mounting location disposed on the opposite side of said first mounting pad array comprising at least one second mounting pad array wherein said first and second mounting pad arrays are conductively coupled with said carrier; and
first and second sets of integrated circuit packages, each set comprising at least one package, and each package having a package body comprising at least one integrated circuit chip and a ball-grid array, wherein said ball-grid array of said at least one first integrated circuit package is directly above said first mounting pad array and said ball-grid array of said second integrated circuit package is directly beneath said second mounting pad array, and wherein said ball-grid array of said first and second sets of integrated circuit packages are conductively bonded to said first and second mounting arrays; and
said carrier further comprises a carrier body with a recess for receiving at least a portion of said second set of integrated circuit packages.
11. The electronic circuit module of claim 10 further comprising a printed circuit board having at least one interconnection pad array coupled to circuitry on said printed circuit and conductively bonded to said carrier.
12. The electronic circuit module of claim 10 wherein individual mounting pads of said at least one first mounting pad array are coupled to individual mounting pads of said at least one second mounting pad array by means of conductive links within said carrier.
13. The electronic circuit module of claim 10 further comprising a flexible polymeric film comprising first and second major planar faces corresponding, respectively, to said first and second integrated circuit mounting locations.
14. The electronic circuit module of claim 10 wherein said carrier further comprises a semi-rigid laminar substrate having first and second major faces corresponding, respectively, to said first and second integrated circuit mounting locations.
15. The electronic circuit module of claim 10 wherein said carrier further comprises individual mounting pads of said at least one first mounting pad array and said at least one second mounting pad array are conductively coupled to individual balls of said ball-grid array of said carrier, and wherein said ball-grid array is conductively coupled to said interconnection pad array.
16. The electronic circuit module of claim 13 wherein each of said first and second major faces incorporates a recess for receiving a single integrated circuit package.
17. The electronic circuit module of claim 13 wherein said first major face is planar, and said second major face comprise a recess, said first sets of integrated circuit packages are mounted on said planar first major face and said second sets of integrated circuit packages are mounted within said recess.
18. The electronic circuit module of claim 10 further comprising at least a second carrier conductively bonded with said printed circuit board.
19. The electronic circuit module of claim 10 wherein said ball-grid array on said carrier comprises balls configured in at least a single row.
20. The electronic circuit module of claim 10 wherein said ball-grid array on said carrier comprises balls configured in a double row.
21. An electronic module comprising:
a carrier, comprising:
at least one mounting pad array,
a ball-grid array, and
a carrier interface,
wherein said at least one mounting pad array is coupled with said carrier interface and said ball-grid array is conductively coupled with said carrier interface
wherein said carrier further comprises a recess; and
at least one integrated circuit package comprising:
an integrated circuit chip, and
a ball-grid array,
wherein said ball-grid array of said at least one integrated circuit package is directly above said at least one mounting pad array,
wherein said ball-grid array on said at least one integrated circuit package are conductively bonded to said at least one mounting pad arrays, and
wherein said recess of said carrier is adapted to receive the body of a second integrated circuit package.
22. The electronic module of claim 21 wherein said ball-grid array on said carrier comprises balls configured in at least a single row.
23. The electronic module of claim 21 wherein said ball-grid array on said carrier comprises balls configured in a double row.
24. The electronic module of claim 21 further comprising a printed circuit board comprising at least one interconnection pad array coupled to circuitry on said printed circuit and conductively bonded to said carrier.
25. The electronic module of claim 21 wherein said ball-grid array is selected from the group of Polyimide ball-grid array and ceramic ball-grid array.
26. The electronic module of claim 21 wherein individual mounting pads of said mounting pad array are coupled with said carrier interface with individual balls of said ball-grid array by means of conductive links within said carrier.
27. The electronic module of claim 21 further comprising a second carrier, comprising:
a second mounting pad array,
a second ball-grid array, and
a second carrier interface,
wherein said second mounting pad array is coupled with said second carrier interface and said second ball-grid array is conductively coupled with said second carrier interface;
a second integrated circuit package comprising:
a second integrated circuit chip, and
a second ball-grid array,
wherein said second ball-grid array on said second integrated circuit package are conductively bonded to said second mounting pad arrays; and
a printed circuit board having at least one interconnection pad array coupled to circuitry on said printed circuit and conductively bonded to said second carrier interface and said carrier interface.
28. The electronic module of claim 27 wherein second carrier further comprises a carrier body with a recess within said second carrier.
29. The electronic module of claim 21 further comprising:
a second integrated circuit package comprising:
a second integrated circuit chip, and
a second ball-grid array;
wherein said interconnection pad array on said printed circuit board comprises interconnection pads beneath the recess in said carrier and said second ball-grid array on said second integrated circuit package are conductively bonded to said interconnection array beneath the recess in said carrier on said printed circuit board.