Semiconductor device having a hollow region and method of manufacturing the same
A hollow region is formed in a silicon substrate. A plurality of openings formed in the silicon layer on the hollow region is filled with a buried film. The bottom portion of the hollow region is formed with a plurality of silicon pillars, which support the silicon layer.
1. A semiconductor device comprising:
a silicon layer formed on the surface of a silicon substrate;
a source/drain region of a MOS transistor formed in the silicon layer and a body in contact with the source/drain region;
a silicon pillar formed in the silicon substrate under the body;
a hollow region formed in the silicon substrate under the source/drain region; and
a buried layer formed in the silicon layer, the buried layer being located on the hollow region and being in contact with the source/drain region.
2. The device according to claim 1 , further comprising:
a gate insulating film formed on the silicon layer corresponding to the body; and
a gate electrode formed on the gate insulating film.
3. The device according to claim 1 , wherein the buried layer is configured by an insulating film.
4. The device according to claim 1 , wherein the silicon pillar is configured by a single crystal silicon.