Fence-free etching of iridium barrier having a steep taper angle
View Patent ↗An Iridium barrier layer is between a contact plug and a bottom electrode of a capacitor. Etching is performed to pattern the bottom electrode and barrier layer using a fluorine-based recipe resulting in the formation of a first fence clinging to the sidewalls. Next the remaining barrier layer is etched using a CO-based recipe. A second fence is formed clinging to and structurally supported by the first fence. At the same time, the CO-based recipe etches away a substantial portion of the first fence to remove the structural support provided to the second fence. The second fence is therefore lifted-off from the sidewalls leaving the sidewalls substantially free of clinging fences. The etched barrier layer has a sidewall transition. The sidewalls have a relatively low taper angle above the sidewall transition and a relatively steep taper angle below the sidewall transition.
1. A method for manufacturing a ferroelectric capacitor comprising the steps of:
forming a substructure of the capacitor having a contact plug passing therethrough for electrically connecting a bottom electrode of the capacitor to an underlying active layer;
depositing over the substructure the bottom electrode including a barrier layer intermediate therebetween;
depositing over the bottom electrode a ferroeletric layer such that the diffusion of contaminants from the ferroelectric layer to the contact plug is inhibited by the intermediate barrier layer;
depositing over the ferroelectric layer a top electrode;
depositing over the top electrode, the underlying ferroelectric layer and the bottom electrode a first hardmask;
etching to pattern the top electrode using the first hardmask;
depositing over the remaining portions of the first hardmask and on the bottom electrode an additional hardmask;
etching to pattern the bottom electrode using a first recipe resulting in the formation of a first fence clinging to sidewalls of the additional hardmask, bottom electrode and barrier layer; and
etching the intermediate barrier layer using a second recipe resulting in the formation of a second fence clinging to and structurally supported by the first fence while at the same time etching away a substantial portion of the first fence to remove the structural support provided to the second fence so that the second fence is lifted-off from the sidewalls leaving the sidewalls substantially free of clinging fences.
2. The method of claim 1 wherein the intermediate barrier layer has a composition including Iridium.
3. The method of claim 2 , wherein 30% to 90% of the barrier layer not protected by the additional hardmask is removed during the etching using the first recipe.
4. The method of claim 1 , wherein the etching of the intermediate barrier layer using the second recipe continues until portions of the substructure are also etched.
5. The method of claim 1 , wherein the additional hardmask is tapered at an angle steeper than 60 degrees.
6. The method of claim 1 , wherein the contaminants include oxygen.
7. The method of claim 1 , wherein the first recipe is a fluorine-based recipe.
8. The method of claim 1 , wherein the second recipe is a CO-based recipe.
9. The method of claim 1 , wherein the additional hardmask is formed from TEOS.