Emulation solution for programmable instruction DSP
View Patent ↗To serve prototype and initial production requirements, an emulation solution is described where an ASIC semiconductor device die containing primarily fixed functions, for example a DSP processor with programmable instruction interface, is mounted in the same package as a conventional FPGA device—the FPGA in this example implementing custom instructions for DSP algorithm acceleration and connecting primarily to the fixed function device. A fully integrated, single die ASIC solution is then available for migration of designs to higher volume production where some of the field programmable function will be replaced with fixed function. The base wafer for the ASIC device used in the prototype package and base wafer for the volume production ASIC device may be the same.
1. A family of integrated circuit packages, said family comprising a plurality of integrated circuit packages, wherein each of said packages includes provision for attaching a single fixed-function custom device and a single field-programmable gate array device; and
wherein each package of said packages has I/O connections leaving the package; and
wherein said I/O connections leaving an integrated circuit package within said family come primarily from said fixed function custom device, said I/O connections being compatible in terms of I/O functionality and footprint for all integrated circuit packages in said family; and
wherein each of said field programmable gate array devices has a different logic capacity for each member of said family.
2. The family of integrated circuit packages of claim 1 where said field-programmable gate array device is a packaged device.
3. The family of integrated circuit packages of claim 1 where for each integrated circuit package in said family, said field programmable gate array device is mounted on the top side of said integrated circuit package and said fixed function custom device is mounted on the bottom side.
4. The family of integrated circuit packages of claim 1 where for each integrated circuit package in said family, said fixed function custom device is identical to that on each of the other packages in the family.
5. The family of integrated circuit packages of claim 1 where said fixed function custom device contains a software-programmable processor.
6. The family of integrated circuit packages of claim 5 where said software-programmable processor also includes a configurable instruction interface to connect with instruction logic implemented in configurable logic.
7. A family of integrated circuit packages, said family comprising a plurality of integrated circuit packages, wherein each of said packages includes provision for attaching a single fixed-function device and a single field-programmable gate array device, and
wherein each package of said packages has I/O connections leaving the package; and
wherein said I/O connections leaving an integrated circuit package within said family come primarily from said fixed function device, said I/O connections being compatible in terms of I/O functionality and footprint for all integrated circuit packages in said family; and
wherein said field programmable gate array device has a different logic capacity for each member of said family; and
wherein said fixed function device contains a software-programmable processor with a configurable instruction interface, said configurable instruction interface connecting with instruction logic implemented in configurable logic contained within said field-programmable gate array device.
8. The family of integrated circuit packages of claim 7 wherein for each integrated circuit package in said family, said field programmable gate array device is mounted on the topside of said integrated circuit package and said fixed function device is mounted on the bottom side.
9. The family of integrated circuit packages of claim 8 wherein said field programmable gate array device is a packaged device.
10. A family of integrated circuit packages, said family comprising a plurality of integrated circuit packages, wherein each of said packages includes provision for attaching a single fixed-function device and a single field-programmable gate array device; and
wherein for each integrated circuit package in said family, said field programmable gate array device is mounted on the topside of said package and said fixed function device is mounted on the bottom side; and
wherein said fixed function device includes a software-programmable processor; and
wherein for each integrated circuit package in said family, said field programmable gate array device has a different logic capacity.
11. The family of integrated circuit packages of claim 10 wherein said field programmable gate array device is a packaged device.
12. A family of integrated circuit packages, said family comprising a plurality of integrated circuit packages, wherein each of said packages includes provision for attaching a single fixed-function device and a single field-programmable gate array device; and
wherein each package of said packages has I/O connections leaving the package; and
wherein said I/O connections leaving an integrated circuit package come primarily from said fixed function device, said I/O connections being compatible in terms of I/O functionality and footprint for all integrated circuit packages in said family; and
wherein said field programmable gate array device has a different logic capacity for each member of said family; and
wherein for each integrated circuit package in said family, said field programmable gate array device is mounted on the top side of said integrated circuit package and said fixed function prototype device is mounted on the bottom side.
13. A family of integrated circuit packages, said family comprising a plurality of integrated circuit packages, wherein each of said packages includes provision for attaching a single fixed-function device and a single field-programmable gate array device; and
wherein said field programmable gate array device has a different logic capacity for each member of said family; and
wherein said fixed function device is identical to that on each of the other packages in said family; and
wherein said fixed function device includes a software-programmable processor; and
wherein for each integrated circuit package in said family, said field programmable device is mounted on the top side of said integrated circuit package and said fixed function prototype device is mounted on the bottom side; and
wherein each package of said packages has I/O connections leaving the package; and
wherein the I/O connections for all integrated circuit packages within said family are compatible in terms of I/O functionality and footprint such that one member of said family can always be substituted for other members of said family when mounted in the same physical location on a user's board level circuit.
14. The family of integrated circuit packages of claim 13 wherein said field programmable gate array device is a packaged device.