IP Library Granted Patent US 6,947,224
Granted Patent B2
US 6,947,224 · App. 10/666,444 · Granted Sep 20, 2005

Methods to make diffractive optical elements

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Quick Facts
Patent No.
US 6,947,224
App. No.
10/666,444
Granted
Sep 20, 2005
Kind
B2
Abstract

A method for forming a diffractive lens includes forming an etch stop layer on a first surface of a silicon substrate, forming a diffractive optical element above the etch stop layer, forming a planarization layer covering the diffractive optical element, planarizing the planarization layer, forming a bonding layer on the planarization layer, bonding a transparent substrate on the bonding layer, and etching a second surface of the silicon substrate to the etch stop layer to remove a portion of the silicon substrate opposite the diffractive optical element, wherein the remaining portion of the silicon substrate forms a bonding ring.

Claims (136)

1. A method for forming a diffractive lens, comprising:

forming a stack comprising above a first surface of a transparent substrate, the stack comprising at least two phase shifting layers separated by an etch stop layer, the transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

patterning the stack to form layers of a diffractive optical element; and

bonding a bonding ring to the first surface of the transparent substrate around the diffractive optical element.

2. The method of claim 1 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

3. The method of claim 1 , wherein said forming a stack comprises:

(1) depositing a first phase shifting layer comprising a material selected from the group consisting of amorphous silicon and silicon nitride;

(2) growing the etch stop layer comprising silicon dioxide on the first phase shifting layer; and

(3) depositing a second phase shifting layer comprising the material on the etch stop layer.

4. The method of claim 1 , further comprising forming an opaque coating on a second surface of the substrate.

5. The method of claim 4 , wherein the opaque coating comprises amorphous silicon.

6. The method of claim 1 , further comprising, prior to said forming a stack:

forming an antireflective coating on the first surface of the transparent substrate, wherein the stack is formed on the antireflective coating.

7. The method of claim 1 , further comprising, subsequent to said patterning the stack:

forming an antireflective coating over the diffractive optical element.

8. The method of claim 1 , wherein said bonding comprises forming a bond selected from the group consisting of an anodic bond, an adhesive bond, a hydrofluoric acid bond, and a glass frit bond.

9. The method of claim 1 , further comprising bonding a submount to the bonding ring to form a package.

10. A method for forming a diffractive lens, comprising:

forming stack comprising above a first surface of a transparent substrate, the stack comprising at least two phase shifting layers separated by an etch stop layer, the transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

patterning the stack to form layers of a diffractive optical element; and

bonding a submount to the first surface of the transparent substrate with silicone.

11. A method for forming a diffractive lens, comprising:

providing a silicon-on-insulator (SOI) substrate comprising a transparent device layer, an insulator layer below the device layer, and a handle layer below the insulator layer, the transparent device layer being transmissive to a light wavelength selected from infrared to ultraviolet;

forming a stack above the transparent device layer, the stack comprising at least two phase shifting layers separated by an etch stop layer;

patterning the stack to form layers of a diffractive optical element; and

etching the handle layer to the insulator layer to remove a portion of the handle layer opposite the diffractive optical element, wherein the remaining portion of the handle layer forms a bonding ring.

12. The method of claim 11 , further comprising:

etching the insulator layer to remove a portion of the insulator layer opposite the diffractive optical element.

13. The method of claim 12 , further comprising:

forming an antireflective coating on a second surface of the transparent device layer opposite the diffractive optical element.

14. The method of claim 11 , further comprising:

forming a bonding pad on the bonding ring.

15. The method of claim 11 , further comprising:

forming a planarization layer over the diffractive optical element; and

planarizing the planarization layer.

16. The method of claim 15 , further comprising:

forming an antireflective layer on the planarization layer.

17. A diffractive lens, comprising:

a transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

a diffractive optical element above a first surface of the transparent substrate, the diffractive optical element comprising at least two phase shifting layers separated by an etch stop layer; and

a bonding ring bonded to the first surface of the transparent substrate around the diffractive optical element.

18. The lens of claim 17 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

19. The lens of claim 17 , further comprising an opaque coating on a second surface of the substrate.

20. The lens of claim 19 , wherein the opaque coating comprises amorphous silicon.

21. The lens of claim 17 , further comprising:

an antireflective coating between the first surface of the transparent substrate and the diffractive optical element.

22. The lens of claim 17 , further comprising:

an antireflective coating over the diffractive optical element.

23. The lens of claim 17 , wherein the bonding ring is bonded to the transparent substrate by a bond selected from the group consisting of an anodic bond, an adhesive bond, a hydrofluoric acid bond, and a glass frit bond.

24. The lens of claim 17 , further comprising:

a submount bonded to the bonding ring to form a package.

25. A diffractive lens, comprising:

a transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

a diffractive optical element above a first surface of the transparent substrate, the diffractive optical element comprising at least two phase shifting layers separated by an etch stop layer; and

a submount bonded to the first surface of the transparent substrate with silicone.

26. A diffractive lens, comprising:

a silicon-on-insulator (SOI) substrate comprising a transparent device layer, an insulator layer below the device layer, and a handle layer below the insulator layer, the transparent device layer being transmissive to a light wavelength selected from infrared to ultraviolet, the handle layer being etched so the remaining portion of the handle layer forms a bonding ring;

a diffractive optical element above a first surface of the transparent device layer, the diffractive optical element comprising at least two phase shifting layers separated by an etch stop layer.

27. The lens of claim 26 , further comprising:

an antireflective coating on a second surface of the transparent device layer opposite the diffractive optical element.

28. The lens of claim 26 , further comprising:

a bonding pad on the bonding ring.

29. The lens of claim 26 , further comprising:

a planarization layer over the diffractive optical element.

30. The lens of claim 29 , further comprising:

an antireflective layer over the planarization layer.

31. A method for forming a diffractive lens, comprising:

forming an etch stop layer on a first surface of a silicon substrate;

forming a diffractive optical element above the etch stop layer;

forming a planarization layer over the diffractive optical element;

planarizing the planarization layer;

bonding a transparent substrate to the planarization layer, the transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet; and

etching a second surface of the silicon substrate to the etch stop layer to remove at least a portion of the silicon substrate opposite the diffractive optical element.

32. The method of claim 31 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

33. The method of claim 31 , wherein said forming a diffractive optical element comprises:

forming a stack comprising at least two phase shifting layers separated by another etch stop layer; and

pattering the stack to form layers of the diffractive optical element.

34. The method of claim 31 , wherein said bonding a transparent substrate to the planarization layer comprises:

forming a bonding layer on the planarization layer; and

bonding the transparent substrate on the bonding layer by an anodic bond.

35. The method of claim 31 , further comprising, prior to said forming a diffractive optical element:

forming an antireflective layer on the etch stop layer, wherein the diffractive optical element is formed on the antireflective layer.

36. The method of claim 35 , further comprising:

etching the etch stop layer to remove a portion of the etch stop layer opposite the diffractive optical element.

37. The method of claim 31 , wherein the remaining portion of the silicon substrate forms a bonding ring.

38. The method of claim 37 , further comprising:

forming a bonding pad on the bonding ring.

39. The method of claim 37 , further comprising:

bonding a submount to the bonding ring to form a package.

40. The method of claim 31 , wherein said etching a second surface of the silicon substrate further comprises removing all of the silicon substrate.

41. A diffractive lens, comprising:

a transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

a planarization layer below the transparent substrate;

a diffractive optical element below the planarization layer; and

an etch stop layer below the diffractive optical element.

42. The diffractive lens of claim 41 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

43. The diffractive lens of claim 41 , wherein the diffractive optical element comprises at least two phase shifting layers separated by another etch stop layer.

44. The diffractive lens of claim 41 , further comprising:

a bonding layer between the transparent substrate and the planarization layer.

45. The diffractive lens of claim 41 , further comprising:

an antireflective layer between the etch stop layer and the diffractive optical element.

46. The diffractive lens of claim 41 , further comprising:

a bonding ring below the etch stop layer.

47. The diffractive lens of claim 46 , further comprising:

a bonding pad on the bonding ring.

48. The diffractive lens of claim 46 , further comprising:

a submount bonded to the bonding ring from a package.

49. A method for forming a diffractive lens, comprising:

forming a mold for a diffractive optical element on a first surface of a silicon substrate;

forming a lens layer above the mold, wherein the lens layer conforms to the mold to form the diffractive optical element, the lens layer being transmissive to a light wavelength selected from infrared to ultraviolet;

planarizing the lens layer;

bonding a transparent substrate to the lens layer; and

etching a second surface of the silicon substrate opposite of the diffractive optical element, wherein the remaining portion of the silicon substrate forms a bonding ring.

50. The method of claim 49 , further comprising, prior to said forming a lens layer above the mold:

forming an etch stop layer on the mold; and

wherein the lens layer is formed on the etch stop layer and said etching a second surface of the silicon substrate comprises etching the silicon substrate to the etch stop layer.

51. The method of claim 49 , wherein the lens layer comprises a material selected from the group consisting of silicon nitride and silicon dioxide.

52. The method of claim 49 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

53. The method of claim 49 , wherein said forming a mold comprises:

forming a stack comprising at least two lens layers separated by an etch stop layer; and

patterning the stack to form layers of the mold for the diffractive optical element.

54. The method of claim 49 , further comprising:

forming a bonding pad on the bonding ring.

55. The method of claim 49 , further comprising bonding a submount to the bonding ring to form a package.

56. A diffractive lens, comprising:

a transparent substrate being transmissive to a light wavelength selected from infrared to ultraviolet;

a diffractive optical element below the transparent substrate; and

a bonding ring below the diffractive optical element.

57. The diffractive lens of claim 56 , further comprising:

an etch stop layer between the diffractive optical element and the bond ring.

58. The diffractive lens of claim 56 , wherein the diffractive optical element comprises a material selected from the group consisting of silicon nitride and silicon dioxide.

59. The diffractive lens of claim 56 , wherein the transparent substrate comprises a material selected from the group consisting of quartz, Pyrex, and sapphire.

60. The diffractive lens of claim 56 , further comprising:

a bonding pad on the bonding ring.

61. The diffractive lens of claim 56 , further comprising:

a submount bonded to the bonding ring from a package.

Assignments (13)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047196 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048555/0510 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047196/0097 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 017207 FRAME 0020. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
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MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0672 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 9, 2004
From: WANG, TAK KUI; MATTHEWS, JAMES ALBERT; VARGHESE, RONNIE PAUL
To: AGILENT TECHNOLOGIES, INC.
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