IP Library Granted Patent US 7,058,101
Granted Patent B2
US 7,058,101 · App. 10/666,999 · Granted Jun 6, 2006

Stepped manifold array of microchannel heat sinks

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Quick Facts
Patent No.
US 7,058,101
App. No.
10/666,999
Granted
Jun 6, 2006
Kind
B2
Abstract

An assembly for providing a concentrated, vertically stacked array of laser beams from a horizontally offset array of electrically serially-connected metallic microchannel heat sinks each bearing a laser diode bar. The heat sinks are mounted on horizontally offset planes of the manifold which has coolant channels serving adjacent heat sinks that are separated from each to increase the electrical resistance of the fluid path between adjacent ones of said heat sinks. Stepped optical deflectors re-arrange the horizontally emitted laser beams into vertical stack.

Claims (13)

1. A manifold for supplying a stack of metallic, microchannel heat sinks each mounting a laser diode bar with coolant fluid, said heat sinks forming part of series-connected electrical path, comprising:

an insulating body having a plurality of offset parallel planes for mounting a respective plurality of said microchannel heat sinks; said planes terminating in coolant channels in fluid communication with corresponding channels in said heat sinks; said coolant channels communicating with adjacent ones of said heat sinks and being separated from each other by at least the width of one of said heat sinks to increase the electrical resistance of said fluid path between adjacent ones of said heat sinks; and

a series of stepped optical deflectors for re-arranging the laser beams emitted from the laser diode bars into vertical stack, said stepped optical deflectors comprising glass plates having a beveled edge positioned to receive the light output of a respective one of said laser diodes.

2. A manifold according to claim 1 wherein said parallel planes are minimally offset from each other so as to concentrate the optical power emitted by said laser diode bars.

3. A series-connected stack of metallic fluid-cooled microchannel heat sinks each bearing a respective laser diode bar for emitting optical power,

an insulating body having a plurality of horizontally offset parallel surfaces for mounting a respective one of said heat sinks; said surfaces having coolant channels in fluid communication with corresponding channels in said heat sinks; said coolant channels communicating with adjacent ones of said heat sinks being separated from each other by at least the width of one of said heat sinks to increase the electrical resistance of said fluid path between adjacent ones of said heat sinks;

a plurality of optical reflective surfaces for detecting the optical power emitted by said lasers into a plurality of vertically stacked beams; and

a series of stepped optical deflectors for re-arranging the laser beams emitted from the laser diode bars into vertical stack, said stepped optical deflectors comprising glass plates having a beveled edge positioned to receive the light output of a respective one of said laser diodes.

4. An assembly for providing a concentrated, vertically stacked array of laser beams from a horizontally offset array of electrically serially-connected metallic microchannel heat sinks each bearing a laser diode bar, comprising:

a coolant channel bearing a manifold having horizontally offset planes each mounting a respective one of said heat sinks; the coolant channels serving adjacent ones of said heat sinks being separated from one another to increase the electrical resistance of the fluid path between adjacent ones of said heat sinks; and

a series of stepped optical deflectors for re-arranging the laser beams emitted from the laser diode bars into vertical stack, said stepped optical deflectors comprised of glass plates having a beveled edge positioned to receive the light output of a respective one of said laser diodes.

5. An assembly according to claim 4 wherein said manifold is manufactured from insulating material.

6. An assembly of claim 5 wherein the coolant in said channels is water.

Assignments (10)
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2022
From: II-VI LASER ENTERPRISE GMBH
To: II-VI DELAWARE, INC.
Reel/Frame 060349/0216 →
RELEASE OF SECURITY INTEREST Recorded Jun 6, 2014
From: WELLS FARGO CAPITAL FINANCE, LLC
To: OCLARO, INC.; OCLARO TECHNOLOTY LIMITED
Reel/Frame 033100/0451 →
CHANGE OF NAME Recorded Feb 12, 2014
From: OCLARO SWITZERLAND GMBH
To: II-VI LASER ENTERPRISE GMBH
Reel/Frame 032251/0069 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 11, 2014
From: OCLARO, INC.; OCLARO TECHNOLOGY LIMITED; OCLARO TECHNOLOGY, INC.; OCLARO PHOTONICS, INC.; AVALON PHOTONICS AG; OCLARO (NORTH AMERICA), INC.
To: OCLARO SWITZERLAND GMBH
Reel/Frame 032250/0324 →
CHANGE OF NAME Recorded Feb 10, 2014
From: NEW FOCUS, INC.
To: OCLARO PHOTONICS, INC.
Reel/Frame 032185/0506 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 6, 2013
From: NEWPORT CORPORATION
To: NEW FOCUS, INC.
Reel/Frame 031155/0590 →
PATENT SECURITY AGREEMENT Recorded Jun 5, 2012
From: OCLARO PHOTONICS, INC.
To: WELLS FARGO CAPITAL FINANCE, INC., AS AGENT
Reel/Frame 028324/0982 →
MERGER AND CHANGE OF NAME Recorded Mar 10, 2009
From: SPECTRA-PHYSICS SEMICONDUCTOR LASERS, INC.
To: NEWPORT CORPORATION
Reel/Frame 022380/0789 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2003
From: TREUSCH, HANS-GEORG; SRINIVASAN, RAMAN
To: SPECTRA-PHYSICS SEMICONDUCTOR LASER
Reel/Frame 014530/0031 →