Method of making a center bond flip chip semiconductor carrier
View Patent ↗A center bond flip chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a plurality of conductive traces. A cut out portion is formed in each trace at a position within a gap of a layer of elastomeric material provided over the traces. Each cut out portion is sized and configured to receive a solder ball for electrically connecting the carrier with a semiconductor die.
1. A method for making a carrier for a semiconductor device, said method comprising:
forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure; and
providing an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die,
wherein said forming a seat with a cut out portion comprises extending the cut out portion to the at least one trace located on the substrate.
2. The method of claim 1 , further comprising the act of affixing the conductive connecting structure to said cut out portion.
3. The method of claim 2 , wherein said affixing comprises affixing a solder ball to said seat.
4. The method of claim 3 , further comprising electroplating said seat with one or more metals.
5. The method of claim 1 , further comprising affixing the conductive connecting structure to said semiconductor die.
6. The method of claim 1 , wherein forming comprises forming a seat with a cut out portion for each trace.
7. The method of claim 1 , wherein said forming comprises laser drilling.
8. The method of claim 1 , wherein said forming comprises mechanical drilling.
9. The method of claim 1 , wherein said forming comprises etching.
10. The method of claim 1 , wherein said forming comprises mechanical coining.
11. The method of claim 1 , wherein said forming comprises laser ablating.
12. A method for making a carrier for a semiconductor device, said method comprising:
forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure; and
providing an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die,
wherein said forming a seat with a cut out portion comprises extending the cut out portion into the substrate.
13. A method of making a semiconductor device comprising:
assembling a carrier, said assembling comprising:
forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure, and
positioning an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die; and
electrically connecting said carrier with the semiconductor die,
wherein said forming a seat with a cut out portion comprises extending the cut out portion into the substrate.
14. The method of claim 13 , further comprising affixing the conductive connecting structure to said cut out portion.
15. The method of claim 14 , wherein said affixing comprises affixing a solder ball to said seat.
16. The method of claim 15 , further comprising electroplating said seat with one or more metals.
17. The method of claim 13 , further comprising affixing the conductive connecting structure to said semiconductor die.
18. The method of claim 13 , wherein forming comprises forming a seat with a cut out portion for each trace.
19. The method of claim 13 , wherein said forming comprises laser drilling.
20. The method of claim 13 , wherein said forming comprises mechanical drilling.
21. The method of claim 13 , wherein said forming comprises etching.
22. The method of claim 13 , wherein said forming comprises mechanical coining.
23. The method of claim 13 , wherein said forming comprises laser ablating.
24. A method of making a semiconductor device comprising:
assembling a carrier, said assembling comprising:
forming a seat with a cut out portion in at least one trace located on a substrate, said seat being sized and configured to receive a conductive connecting structure, and
positioning an elastomeric material over said substrate and said at least one trace with a gap at said seat to allow electrical connection of the conductive connecting structure with a semiconductor die; and
electrically connecting said carrier with the semiconductor die,
wherein said forming a seat with a cut out portion comprises extending the cut out portion to the at least one trace located on the substrate.