IP Library Granted Patent US 7,196,530
Granted Patent B2
US 7,196,530 · App. 10/670,377 · Granted Mar 27, 2007

Device testing contactor, method of producing the same, and device testing carrier

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Quick Facts
Patent No.
US 7,196,530
App. No.
10/670,377
Granted
Mar 27, 2007
Kind
B2
Abstract

A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

Claims (4)

1. A method of testing a device, comprising the step of:

electrically connecting electrode pads of a device testing contactor to electrodes of a device being tested;

the electrode pads being formed on a membrane-type flexible wiring board of the device testing contactor, and the wiring board being directly reinforced by a reinforcing member, and

the device testing contactor comprising the wiring board and the reinforcing member collectively molded and bonded to each other.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0637 →
CHANGE OF NAME Recorded Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →