Low-loss printed circuit board antenna structure and method of manufacture thereof
View Patent ↗The present invention provides a method of manufacturing an antenna structure. In one embodiment, the method includes forming an antenna trace on a substrate proximate a ground plane of the substrate. In addition, the method includes creating an insulation region extending through the substrate and located between the antenna trace and the ground plane.
1. An antenna structure, comprising:
a planar antenna trace formed on a substrate;
a ground plane formed on said substrate, wherein a plane of said substrate on which said planar antenna is located is co-planar or parallel with a plane of said substrate on which said ground plane is located, and said ground plane is non-overlapping with said planar antenna trace; and
an insulation region extending through said substrate and located between said planar antenna trace and said ground plane.
2. The antenna structure recited in claim 1 , wherein said planar antenna trace is a first planar antenna trace and said antenna structure further includes a second planar antenna trace located on an opposing, parallel surface of said substrate and said first and second planar antenna traces are interconnected by a via extending through said substrate.
3. The antenna structure recited in claim 1 wherein said insulation region includes a plurality of insulation regions.
4. The antenna structure recited in claim 3 wherein each of said insulation regions are separated by a portion of said substrate.
5. The antenna structure recited in claim 1 wherein said insulation region is an opening that extends through said substrate and an insulator of said insulation region is air.
6. The antenna structure recited in claim 1 wherein said insulation region includes an insulation material selected from a group consisting of:
ABS plastic;
ceramic; and
Teflon.
7. The antenna structure recited in claim 1 wherein said substrate is a lossy substrate and said insulation region causes an antenna radiation efficiency of said antenna structure to be about −0.5 dB or better.
8. A method of manufacturing an antenna structure, comprising:
forming planar antenna trace on a substrate;
forming a ground plane on said substrate, wherein a plane of said substrate on which said planar antenna is located is co-planar or parallel with a plane of said substrate on which said around plane is located, and said ground plane is non-overlapping with said planar antenna trace; and
creating an insulation region extending through said substrate and located between said planar antenna trace and said ground plane.
9. The method recited in claim 8 , wherein said planar antenna trace is a first planar antenna trace and said antenna structure further includes a second planar antenna trace located on an opposing, parallel surface of said substrate and said first and second planar antenna traces are interconnected by a via extending through said substrate.
10. The method recited in claim 8 , wherein said creating includes creating a plurality of insulation regions.
11. The method recited in claim 8 , wherein said creating a plurality of insulation regions includes creating a plurality of insulation regions separated by a portion of said substrate.
12. The method recited in claim 8 , wherein said creating an insulation region includes creating an opening that extends through said substrate and wherein an insulator of said insulation region is air.
13. The method recited in claim 12 , wherein said creating an opening includes drilling a hole in said substrate.
14. The method recited in claim 8 , wherein said creating includes creating an insulation region having an insulation material selected from a group consisting of:
ABS plastic;
ceramic; and
Teflon.
15. The method recited in claim 8 , wherein said forming includes forming antenna traces located on opposing surfaces of said substrate interconnected by a via extending through said substrate.
16. A printed circuit board (PCB), comprising,
a substrate having a ground plane and conductive traces formed thereon; and
a planar antenna structure, including:
an antenna trace formed on said substrate;
said planar ground plane formed on said substrate, wherein a plane of said substrate on which said planar antenna is located is co-planar or parallel with a plane of said substrate on which said ground plane is locate, and said ground plane is non-overlapping with said antenna trace; and
an insulation region extending through said substrate and located between said antenna trace and said ground plane.
17. The PCB recited in claim 16 , wherein said planar antenna trace is a first planar antenna trace and said antenna structure further includes a second planar antenna trace located on an opposing, parallel surface of said substrate and said first and second planar antenna traces are interconnected by a via extending through said substrate.
18. The PCB recited in claim 16 , further including electrical components mounted on said substrate and interconnected between at least one of said conductive traces and said ground plane to form an operative circuit.
19. The PCB recited in claim 16 , wherein said insulation region includes a plurality of insulation regions separated by a portion of said substrate.
20. The PCB recited in claim 16 , wherein said insulation region is an opening that extends through said substrate and an insulator of said insulation region is air.
21. The PCB recited in claim 16 , wherein said insulation region includes an insulation material selected from a group consisting of:
ABS plastic;
ceramic; and
Teflon.