IP Library Granted Patent US 6,878,965
Granted Patent B2
US 6,878,965 · App. 10/675,493 · Granted Apr 12, 2005

Test structure for determining a region of a deep trench outdiffusion in a memory cell array

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Quick Facts
Patent No.
US 6,878,965
App. No.
10/675,493
Granted
Apr 12, 2005
Kind
B2
Abstract

A test structure for determining a doping region of an outer capacitor electrode of a trench capacitor in a memory cell array. The trench capacitors of the memory cell array are arranged in matrix form. The test structure has two parallel rows of trench capacitors. The outer capacitor electrode of each row of trench capacitors is electrically connected to one another and the basic area of at least one trench capacitor of each row is lengthened on the side facing the other row in such a way that the two trench capacitors overlap in a direction transverse to their extent.

Claims (7)

1. A test structure for determining an extent of a doping region of outer capacitor electrodes of trench capacitors in a memory cell array, the trench capacitors of the memory cell array being arranged in matrix form and each having a trench with an inner capacitor electrode isolated by a dielectric layer from an outer capacitor electrode, formed as a doping region, around a lower trench region, the test structure comprising:

first and second contact-connectible capacitor plates;

a first row of trench capacitors formed with outer capacitor electrodes electrically connected to said first capacitor plate, and a second row of trench capacitors disposed parallel to said first row of trench capacitors and formed with outer capacitor electrodes electrically connected to said second capacitor plate;

in a plan view, at least one trench capacitor of said first row of trench capacitors and at least one trench capacitor of said second row of trench capacitors each having a lengthened basic area on a side facing the respective other row of said trench capacitors and overlapping the respectively other lengthened basic areas.

2. The test structure according to claim 1 , formed in a kerf region on a semiconductor wafer.

3. The test structure according to claim 1 , wherein a basic area of at least one further trench capacitor of said second row of trench capacitors is lengthened on the side facing said first row, forming an interleaved comb structure together with said at least one trench capacitor of said first row and said at least one trench capacitor of said second row having the lengthened basic areas, wherein said trench capacitor with the lengthened basic area of said first row of trench capacitors is spaced equidistantly from said two trench capacitors with the lengthened basic areas of said second row of trench capacitors.

4. A test structure pattern, comprising a multiplicity of test structures according to claim 3 , with different said test structures having different spacings between said two outer trench capacitors with the lengthened basic areas of said second row of trench capacitors and said central trench capacitor with the lengthened basic area of said first row of trench capacitors.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 15, 2010
From: INFINEON TECHNOLOGIES AG
To: QIMONDA AG
Reel/Frame 023796/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 4, 2005
From: FELBER, ANDREAS; ROSSKOPF, VALENTIN
To: INFINEON TECHNOLOGIES AG
Reel/Frame 016324/0658 →