Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates
View Patent ↗A method and apparatus for mechanically and/or chemical-mechanically planarizing microelectronic substrates. In one embodiment in accordance with the principles of the present invention, a microelectronic substrate is planarized or polished on a planarizing medium having a thin film and a plurality of micro-features on the film The film may be an incompressible sheet or web substantially impervious to a planarizing solution, and the micro-features may be configured in a selected pattern on the film to restrain fluid flow of the planarizing solution across the surface of the film under the substrate. The micro-features, for example, may be configured in a selected pattern that has a plurality of support points and at least one cavity to entrap a substantially contiguous, uniform distribution of the solution under the substrate during planarization. Additionally, the selected pattern of micro-features may be reproduced from a master pattern of micro-features to duplicate the selected pattern on several sections of film so that a consistent planarizing surface may be provided for a large number of substrates.
1. A method of manufacturing a microelectronic substrate, comprising:
positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine, the planarizing film having a plurality of microfeatures having a plurality of first raised features having first peaks at a first height defining support points to contact the substrate and a plurality of second raised features having second peaks at heights less than the first height, the second raised features being interspersed between the first raised features; and
engaging the substrate with the plurality of microfeatures to planarize a surface of the substrate.
2. The method of claim 1 , wherein engaging the substrate with the plurality of microfeatures further comprises moving at least one of the substrate and the planarizing film with respect to the other to translate the substrate across the planarizing film.
3. The method of claim 1 , further comprising disposing a planarizing solution on a surface of the planarizing film; and wherein engaging the substrate with the plurality of microfeatures further comprises entrapping at least a portion of the planarizing solution between the plurality of first raised features and the plurality second raised features.
4. The method of claim 3 , wherein entrapping at least a portion of the planarizing solution between the plurality of first raised features and the plurality second raised features further comprises restraining a flow of the planarizing flow on the planarizing film; and
retaining a substantially uniform and contiguous distribution of the planarizing fluid between the plurality of first raised features and the plurality second raised features.
5. The method of claim 1 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a polymeric planarizing film on the support base that has a plurality of microfeatures that are embossed on the film in a substantially repetitive arrangement.
6. The method of claim 1 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a polymeric planarizing film on the support base that has a plurality of microfeatures that are embossed on the film in a substantially random arrangement.
7. The method of claim 1 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a fine woven mesh on the support base having a plurality of first raised features defined by high points along the strands, and having a plurality of second raised features defined by a remainder of the strands.
8. The method of claim 1 , wherein positioning a non-abrasive and incompressible planarizing film on a support base further comprises:
wrapping a flexible web having the plurality of microfeatures around a supply roller and a take up roller; and
extending a portion of the flexible web across the support base.
9. The method of claim 8 , further comprising retaining a first portion of the web at a work station while a first substrate is planarized; and advancing the web to position a second portion of the web at the work station to planarize a second substrate.
10. The method of claim 1 , wherein positioning a non-abrasive and incompressible planarizing film on a support base further comprises removably attaching the planarizing film to the support base.
11. A method of manufacturing a microelectronic substrate, comprising:
positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine, the planarizing film having a plurality of nodules having a plurality of shapes and heights, the nodules being patterned on the film to form a plurality elevated support points to contact the substrate and a plurality of depressions between the elevated support points; and
engaging the substrate with the plurality of nodules to planarize a surface of the substrate.
12. The method of claim 11 , wherein engaging the substrate with the plurality of nodules further comprises moving at least one of the substrate and the planarizing film with respect to the other to translate the substrate across the planarizing film.
13. The method of claim 11 , further comprising disposing a planarizing solution on a surface of the planarizing film; and wherein engaging the substrate with the plurality of nodules further comprises entrapping at least a portion of the planarizing solution between the plurality of nodules.
14. The method of claim 13 , wherein entrapping at least a portion of the planarizing solution between the plurality of nodules comprises restraining a flow of the planarizing flow on the planarizing film; and
retaining a substantially uniform and contiguous distribution of the planarizing fluid between the plurality of nodules.
15. The method of claim 11 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a polymeric planarizing film on the support base that has a plurality of nodules that are embossed on the film in a substantially repetitive arrangement.
16. The method of claim 11 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a polymeric planarizing film on the support base that has a plurality of nodules that are embossed on the film in a substantially random arrangement.
17. The method of claim 11 , wherein positioning a non-abrasive and incompressible planarizing film on a support base of a planarizing machine further comprises disposing a fine woven mesh on the support base having a plurality of first raised features defined by high points along the strands, and having a plurality of second raised features defined by a remainder of the strands.
18. The method of claim 11 , wherein positioning a non-abrasive and incompressible planarizing film on a support base further comprises:
wrapping a flexible web having the plurality of nodules around a supply roller and a take up roller; and
extending a portion of the flexible web across the support base.
19. The method of claim 18 , further comprising retaining a first portion of the web at a work station while a first substrate is planarized; and advancing the web to position a second portion of the web at the work station to planarize a second substrate.
20. The method of claim 11 , wherein positioning a non-abrasive and incompressible planarizing film on a support base further comprises removably attaching the planarizing film to the support base.