IP Library Granted Patent US 7,045,823
Granted Patent B2
US 7,045,823 · App. 10/687,804 · Granted May 16, 2006

Optical semiconductor device having semiconductor laser and electroabsorptive modulator

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Quick Facts
Patent No.
US 7,045,823
App. No.
10/687,804
Granted
May 16, 2006
Kind
B2
Abstract

An optical semiconductor device comprises a semiconductor laser ( 11 ) including a lower clad layer, an active layer ( 4 ), and an upper layer formed in this order, an electroabsorptive modulator ( 12 ) including the lower clad, a light absorption layer ( 6 ), and the upper clad layer formed in this order, and a separation region ( 13 ) provided between the semiconductor laser and the electroabsorptive modulator. The upper clad layer extends from the semiconductor laser through the separation region to the electroabsorptive modulator and up to the side of the separation region.

Claims (37)

1. An optical semiconductor device comprising:

a substrate;

a semiconductor laser including a lower clad layer, an active layer, and an upper clad layer formed in this order on said substrate;

an electroabsorptive modulator including said lower clad layer, a light absorption layer, and said upper clad layer formed in this order on said substrate;

a separation region provided between said semiconductor laser and said electroabsorptive modulator and including said lower clad layer, a wave guide layer, and said upper clad layer formed in this order on said substrate; and

a channel from which said upper clad layer is removed, said channel being provided such that said channel surrounds said upper clad layer, said channel extending up to said side of said separation region, wherein

said upper clad layer extends from said semiconductor laser through said separation region to said electroabsorptive modulator,

said electroabsorptive modulator receives light generated from said semiconductor laser in a wave guide direction through the wave guide layer,

said semiconductor laser, separation region, and electroabsorptive modulator each has a side provided in parallel with the wave guide direction of the light, and

said upper clad layer extends in a direction crossing the wave guide direction up to said side of said separation region.

2. The optical semiconductor device according to claim 1 , which further comprises a lower electrode provided on an under-side of said substrate.

3. The optical semiconductor device according to claim 1 , wherein said upper clad layer extends from said semiconductor laser through said separation region to said electroabsorptive modulator via said each side.

4. An optical semiconductor device, comprising:

a substrate;

a semiconductor laser including a lower clad layer, an active layer, and an upper clad layer formed in this order on said substrate;

an electroabsorptive modulator including said lower clad layer, a light absorption layer, and said upper clad layer formed in this order on said substrate;

a separation region provided between said semiconductor laser and said electroabsorptive modulator and including said lower clad layer, a wave guide layer, and said upper clad layer formed in this order on said substrate;

a contact layer provided on said upper clad layer, said contact layer having a high resistance;

a first upper electrode provided on said contact layer in said semiconductor laser; and

a second upper electrode provided on said contact layer in said electroabsorptive modulator, wherein

said upper clad layer extends from said semiconductor laser through said separation region to said electroabsorptive modulator,

said electroabsorptive modulator receives light generated from said semiconductor laser in a wave guide direction through the wave guide layer,

said semiconductor laser, separation region, and electroabsorptive modulator each has a side provided in parallel with the wave guide direction of the light, and

said upper clad layer extends in a direction crossing the wave guide direction up to said side of said separation region.

5. The optical semiconductor device according to claim 4 , wherein said contact layer is removed from said separation region.

6. The optical semiconductor device according to claim 4 , wherein said high resistance of said contact layer is made by ion-implantation.

7. The optical semiconductor device according to claim 4 , which further comprises a lower electrode provided on an under-side of said substrate.

8. The optical semiconductor device according to claim 4 , wherein said upper clad layer extends from said semiconductor laser through said separation region to said electroabsorptive modulator via said each side.

9. An optical semiconductor device, comprising:

a substrate,

a semiconductor laser formed on the substrate and including an active layer for generating a laser beam in a beam direction,

an electroabsorptive modulator formed on the substrate and including a light absorption layer for receiving the laser beam from the semiconductor laser to generate an electrical signal,

a separation region formed on the substrate between the semiconductor laser and the electroabsorptive modulator, said separation region having side portions extending in parallel to the beam direction,

a slab disposed in the separation region for radiating heat, said slab extending continuously from one of the side portions to the other of the side portions in a direction crossing the beam direction, and

a channel disposed in the separation region around the slab and extending between the side portions of the separation region.

10. The optical semiconductor device according to claim 9 , further comprising a side slab disposed outside at lease one of the side portions of the separation region and extending in the beam direction, said slab being connected to the side slab.

11. The optical semiconductor device according to claim 9 , wherein said semiconductor laser and said electroabsorptive modulator include upper electrodes, respectively, said slab being connected to at least one of the upper electrodes.

Assignments (3)
CHANGE OF NAME Recorded Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
CHANGE OF NAME Recorded Dec 18, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022038/0711 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 20, 2003
From: SUZUKI, TAKAHITO
To: OKI ELECTRIC INDUSTRY CO., LTD.
Reel/Frame 014625/0395 →