Metal oxynitride capacitor barrier layer
View Patent ↗Capacitor structures for use in integrated circuits and methods of their manufacture. The capacitor structures include a bottom electrode, a top electrode and a dielectric layer interposed between the bottom electrode and the top electrode. The capacitor structures further include a metal oxynitride barrier layer interposed between the dielectric layer and at least one of the bottom and top electrodes. Each metal oxynitride barrier layer acts to reduce undesirable oxidation of its associated electrode. Each metal oxynitride barrier layer can further aid in the repairing of oxygen vacancies in a metal oxide dielectric. The capacitors are suited for use as memory cells and apparatus incorporating such memory cells, as well as other integrated circuits.
1. A semiconductor die, comprising:
an integrated circuit supported by a substrate and having a plurality of integrated circuit devices, wherein at least one of the plurality of integrated circuit devices comprises a capacitor, the capacitor comprising:
a bottom electrode;
a first metal oxynitride barrier layer overlying the bottom electrode;
a metal oxide dielectric layer overlying the first metal oxynitride barrier layer;
a second metal oxynitride barrier layer overlying the metal oxide dielectric layer; and
a top electrode overlying the second metal oxynitride barrier layer.
2. The semiconductor die of claim 1 wherein each of the first and second metal oxynitride barrier layers comprises a metal oxynitride having a composition of the form MO x N y , wherein M is a metal component selected from the group consisting of chromium, cobalt, hafnium, iridium, molybdenum, niobium, osmium, rhenium, rhodium, ruthenium, tantalum, titanium, tungsten, vanadium and zirconium.
3. The semiconductor die of claim 1 , wherein the metal component of the first metal oxynitride barrier layer is the same as the metal component of the second metal oxynitride barrier layer.
4. The semiconductor die of claim 2 , wherein x ranges from approximately 0.05 to approximately one-half the maximum valence value of the metal component M minus 0.05 and y ranges from approximately 0.1 to approximately the maximum valence value of the metal component M minus 0.1.
5. The semiconductor die of claim 2 , wherein M is a metal component selected from the group consisting of chromium, hafnium, molybdenum and tungsten, and wherein x ranges from approximately 0.05 to approximately 2.95 and y ranges from approximately 0.1 to approximately 5.9.
6. The semiconductor die of claim 1 , wherein each of the first and second metal oxynitride barrier layers comprises a tungsten oxynitride having a composition of the form WO x N y , wherein x ranges from approximately 0.05 to approximately 2.95 and y ranges from approximately 0.1 to approximately 5.9.
7. The semiconductor die of claim 1 , wherein at least one electrode of the bottom and top electrodes comprises a metal nitride.
8. The semiconductor die of claim 1 , wherein at least one of the bottom and top electrodes comprises tungsten nitride.
9. The semiconductor die of claim 1 , wherein the bottom electrode comprises a metal nitride having a metal component the same as the metal component of the first metal oxynitride barrier layer.
10. A semiconductor die, comprising:
an integrated circuit supported bye substrate and having a plurality of integrated circuit devices, wherein as least one of the plurality of integrated circuit devices comprises a capacitor, the capacitor comprising:
a bottom metal nitride electrode;
a first metal oxynitride barrier layer overlying the bottom metal nitride electrode;
a metal oxide dielectric layer overlying the first metal oxynitride barrier layer;
a second metal oxynitride barrier layer overlying the dielectric layer; and
a top metal nitride electrode overlying the second metal oxynitride barrier layer.
11. The semiconductor die of claim 10 , wherein the metal oxide layer comprises tantalum oxide.
12. The semiconductor die of claim 10 , wherein the bottom and top electrodes comprise tungsten nitride.
13. A semiconductor die, comprising:
an integrated circuit supported by a substrate and having a plurality of integrated circuit devices, wherein at least one of the plurality of integrated circuit devices comprises a capacitor, the capacitor comprising:
a bottom electrode having a bottom electrode metal component;
a top electrode having a top electrode metal component;
a dielectric layer interposed between the bottom electrode and the top electrode;
an oxynitride barrier layer having a barrier metal component, wherein the barrier metal component is different from the bottom electrode metal component, and wherein the oxynitride barrier layer is interposed between the dielectric layer and the bottom electrode; and
a second barrier layer interposed between the dielectric layer and the top electrode.
14. The semiconductor die of claim 13 , wherein the oxynitride barrier layer comprises MO x N y , wherein M is a metal selected from the group consisting of: chromium, cobalt, hafnium, iridium, molybdenum, niobium, osmium, rhenium, rhodium, ruthenium, tantalum, titanium, tungsten, vanadium and zirconium.
15. The semiconductor die of claim 14 , wherein x ranges from approximately 0.05 to approximately one-half the maximum valence value of the metal M minus 0.05 and y ranges from approximately 0.1 to approximately the maximum valence value of the metal M minus 0.1.
16. The semiconductor die of claim 14 , wherein M is a metal selected from the group consisting of chromium, hafnium, molybdenum and tungsten, and wherein x ranges from approximately 0.05 to approximately 2.95 and y ranges from approximately 0.1 to approximately 5.9.
17. The semiconductor die of claim 13 , wherein the oxynitride barrier layer comprises a tungsten oxynitride having a composition of the form WO x N y , wherein x ranges from approximately 0.05 to approximately 2.95 and y ranges from approximately 0.1 to approximately 5.9.
18. The semiconductor die of claim 13 , wherein at least one of the top and bottom electrodes comprises a metal nitride.
19. A semiconductor die, comprising:
an integrated circuit supported by a substrate and having a plurality of integrated circuit devices, wherein at least one of the plurality of integrated circuit devices comprises a capacitor, the capacitor comprising:
a bottom electrode having a bottom electrode metal component;
a top electrode having a top electrode metal component;
a dielectric layer interposed between the bottom electrode and the top electrode;
an oxynitride barrier layer having a barrier metal component, wherein the barrier metal component is different from the bottom electrode metal component, and wherein the oxynitride barrier layer is interposed between the dielectric layer and the bottom electrode; and
a second barrier layer interposed between the dielectric layer and the top electrode, wherein at least one of the top and bottom electrodes comprises tungsten nitride.
20. The semiconductor die of claim 13 , wherein the dielectric layer comprises a metal oxide dielectric material selected from the group consisting of Ba z Sr (1-z) TiO 3 , (where 0<z<1), BaTiO 3 , SrTiO 3 , PbTiO 3 , Pb(Zr,Ti)O 3 , (Pb,La)(Zr,Ti)O 3 , (Pb,La)TiO 3 , Ta 2 O 5 , KNO 3 , Al 2 O 3 and LiNbO 3 .
21. The semiconductor die of claim 13 , wherein the dielectric layer comprises tantalum oxide.
22. A semiconductor die comprising:
an integrated circuit supported by a substrate and having a plurality of integrated circuit devices, wherein at least one of the plurality of integrated circuit devices comprises a capacitor, the capacitor comprising:
a bottom electrode having a bottom electrode metal component;
a top electrode having a top electrode metal component;
a dielectric layer interposed between the bottom electrode and the top electrode;
a tungsten oxynitride barrier layer having a barrier metal component, wherein the barrier metal component is different from the bottom electrode metal component, wherein the tungsten oxynitride barrier layer is interposed between the dielectric layer and the bottom electrode; and
a second barrier layer interposed between the dielectric layer and the top electrode.
23. The semiconductor die of claim 22 , wherein the tungsten oxynitride barrier layer has a composition of the form WO x N y , wherein x ranges from approximately 0.05 to approximately 2.95 and y ranges from approximately 0.1 to approximately 5.9.
24. The semiconductor die of claim 22 , wherein at least one of the top end bottom electrodes comprises a metal nitride.